3 research outputs found
Planar n-in-n quad module prototypes for the ATLAS ITk upgrade at HL-LHC
In order to meet the requirements of the High Luminosity LHC (HL-LHC), it
will be necessary to replace the current tracker of the ATLAS experiment.
Therefore, a new all-silicon tracking detector is being developed, the
so-called Inner Tracker (ITk). The use of quad chip modules is intended in its
pixel region. These modules consist of a silicon sensor that forms a unit along
with four read-out chips. The current ATLAS pixel detector consists of planar
n-in-n silicon pixel sensors. Similar sensors and four FE-I4 read-out chips
were assembled to first prototypes of planar n-in-n quad modules. The main
focus of the investigation of these modules was the region between the read-out
chips, especially the central area between all four read-out chips. There are
special pixel cells placed on the sensor which cover the gap between the
read-out chips. This contribution focuses on the characterization of a
non-irradiated device, including important sensor characteristics, charge
collection determined with radioactive sources as well as hit efficiency
measurements, performed in the laboratory and at testbeams. In addition, first
laboratory results of an irradiated device are presented
The ABC130 barrel module prototyping programme for the ATLAS strip tracker
For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector,
consisting of silicon pixel, silicon strip and transition radiation
sub-detectors, will be replaced with an all new 100 % silicon tracker, composed
of a pixel tracker at inner radii and a strip tracker at outer radii. The
future ATLAS strip tracker will include 11,000 silicon sensor modules in the
central region (barrel) and 7,000 modules in the forward region (end-caps),
which are foreseen to be constructed over a period of 3.5 years. The
construction of each module consists of a series of assembly and quality
control steps, which were engineered to be identical for all production sites.
In order to develop the tooling and procedures for assembly and testing of
these modules, two series of major prototyping programs were conducted: an
early program using readout chips designed using a 250 nm fabrication process
(ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm
processing (ABC130 and HCC130 chips). This second generation of readout chips
was used for an extensive prototyping program that produced around 100
barrel-type modules and contributed significantly to the development of the
final module layout. This paper gives an overview of the components used in
ABC130 barrel modules, their assembly procedure and findings resulting from
their tests.Comment: 82 pages, 66 figure
The ABC130 barrel module prototyping programme for the ATLAS strip tracker
For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests