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    18 research outputs found

    Stacking technology for a space constrained microsystem

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    'Institute of Electrical and Electronics Engineers (IEEE)'
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    Oxidation and Reduction of Liquid SnPb (60/40) under Ambient and Vacuum Conditions

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    'The Electrochemical Society'
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    Oxidation and reduction kinetics of eutectic SnPb, InSn, and AuSn: a knowledge base for fluxless solder bonding applications

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    'Institute of Electrical and Electronics Engineers (IEEE)'
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    In-situ observation of the self-alignment during FC-bonding under vacuum with and without H2

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    In-situ observation of FC-bonding with reduced oxygen partial pressures

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    Fluxless FC-soldering in O2 purged ambients

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    'Institute of Electrical and Electronics Engineers (IEEE)'
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    Oxidation Kinetics of Liquid Eutectic Tin-Lead Solder under Ambient and Vacuum Conditions

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    Integrated packaging concept for an intelligent transducer

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    'Instytut Dermatologii Radoslaw Spiewak'
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    Multiple through-wafer interconnects for stacking of microsystems.

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    Pt-Thinfilm Metallization for Fluxless FC-Bonding Using SnPb(60/40) Solder Bump Metallurgy

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