11 research outputs found
ΠΠ½Π΅Π΄ΡΠ΅Π½ΠΈΠ΅ Π³Π°Π·ΠΎΠΊΠΎΠΌΠΏΡΠ΅ΡΡΠΎΡΠ½ΠΎΠΉ ΡΡΠ°Π½ΡΠΈΠΈ Π² ΡΠΈΡΡΠ΅ΠΌΡ ΡΡΠΈΠ»ΠΈΠ·Π°ΡΠΈΠΈ ΠΏΠΎΠΏΡΡΠ½ΠΎΠ³ΠΎ Π½Π΅ΡΡΡΠ½ΠΎΠ³ΠΎ Π³Π°Π·Π°
Π ΠΏΡΠΎΡΠ΅ΡΡΠ΅ ΡΠ°Π±ΠΎΡΡ Π±ΡΠ» ΡΠ°ΡΡΠΌΠΎΡΡΠ΅Π½ ΠΌΠ°ΠΊΡΠΈΠΌΠ°Π»ΡΠ½ΠΎ ΡΡΡΠ΅ΠΊΡΠΈΠ²Π½ΡΠΉ ΠΌΠ΅ΡΠΎΠ΄ ΡΡΠΈΠ»ΠΈΠ·Π°ΡΠΈΠΈ ΠΏΠΎΠΏΡΡΠ½ΠΎΠ³ΠΎ Π½Π΅ΡΡΡΠ½ΠΎΠ³ΠΎ Π³Π°Π·Π° Π΄Π»Ρ Π΄Π°Π½Π½ΠΎΠ³ΠΎ ΠΌΠ΅ΡΡΠΎΡΠΎΠΆΠ΄Π΅Π½ΠΈΡ, ΠΊΠΎΡΠΎΡΡΠΉ ΠΏΠΎΠ·Π²ΠΎΠ»ΡΠ΅Ρ ΡΡΠΈΠ»ΠΈΠ·ΠΈΡΠΎΠ²Π°ΡΡ 95% ΠΏΠΎΠΏΡΡΠ½ΠΎΠ³ΠΎ Π½Π΅ΡΡΡΠ½ΠΎΠ³ΠΎ Π³Π°Π·Π°.In the course of the work, the most efficient method of utilization of associated petroleum gas for this field was considered, which allows utilizing 95% of associated petroleum gas
ΠΡΠΎΠ³Π½ΠΎΠ·ΠΈΡΠΎΠ²Π°Π½ΠΈΠ΅ Π³ΠΈΠ΄ΡΠ°Π²Π»ΠΈΡΠ΅ΡΠΊΠΎΠ³ΠΎ ΡΠ°Π·ΡΡΠ²Π° ΠΏΠ»Π°ΡΡΠ° Π½ΠΈΠ·ΠΊΠΎΠΏΡΠΎΠ½ΠΈΡΠ°Π΅ΠΌΡΡ ΠΊΠΎΠ»Π»Π΅ΠΊΡΠΎΡΠΎΠ² Π½Π° ΠΎΡΠ½ΠΎΠ²Π΅ ΠΌΠ°ΡΠ΅ΠΌΠ°ΡΠΈΡΠ΅ΡΠΊΠΎΠ³ΠΎ ΠΌΠΎΠ΄Π΅Π»ΠΈΡΠΎΠ²Π°Π½ΠΈΡ Π½Π° ΠΌΠ΅ΡΡΠΎΡΠΎΠΆΠ΄Π΅Π½ΠΈΠΈ Π₯
ΠΠ±ΡΠ΅ΠΊΡΠΎΠΌ ΠΈΡΡΠ»Π΅Π΄ΠΎΠ²Π°Π½ΠΈΡ ΡΠ²Π»ΡΠ΅ΡΡΡ ΠΌΠ΅ΡΡΠΎΡΠΎΠΆΠ΄Π΅Π½ΠΈΠ΅ Π½Π΅ΡΡΠΈ Ρ Π½ΠΈΠ·ΠΊΠΎΠΉ ΠΏΡΠΎΠ½ΠΈΡΠ°Π΅ΠΌΠΎΡΡΡΡ, Π½Π° ΠΊΠΎΡΠΎΡΠΎΠΌ Π±ΡΠ» ΠΏΡΠΎΠ²Π΅Π΄Π΅Π½ Π³ΠΈΠ΄ΡΠΎΡΠ°Π·ΡΡΠ² ΠΏΠ»Π°ΡΡΠ° Ρ ΡΠ΅Π»ΡΡ ΡΠ²Π΅Π»ΠΈΡΠ΅Π½ΠΈΡ Π΄ΠΎΠ±ΡΡΠΈ Π½Π΅ΡΡΠΈ. Π¦Π΅Π»Ρ ΡΠ°Π±ΠΎΡΡ β ΡΠ°Π·ΡΠ°Π±ΠΎΡΠ°ΡΡ ΠΈΠΌΠΈΡΠ°ΡΠΈΠΎΠ½Π½ΡΡ ΠΌΠΎΠ΄Π΅Π»Ρ Π³ΠΈΠ΄ΡΠΎΡΠ°Π·ΡΡΠ²Π° Ρ ΠΈΡΠΏΠΎΠ»ΡΠ·ΠΎΠ²Π°Π½ΠΈΠ΅ΠΌ Π²Π°ΡΠΈΠ°ΡΠΈΠΎΠ½Π½ΠΎΠ³ΠΎ ΠΏΠΎΠ΄Ρ
ΠΎΠ΄Π° ΠΊ Π³ΠΈΠ΄ΡΠΎΡΠ°Π·ΡΡΠ²Ρ Π² ΠΊΠ°ΡΠ΅ΡΡΠ²Π΅ ΠΌΠ΅Ρ
Π°Π½ΠΈΡΠ΅ΡΠΊΠΎΠΉ ΠΌΠΎΠ΄Π΅Π»ΠΈ, ΡΡΠΎ ΠΏΠΎΠ·Π²ΠΎΠ»ΡΠ΅Ρ ΠΈΡΠΏΠΎΠ»ΡΠ·ΠΎΠ²Π°ΡΡ Π΅Π΄ΠΈΠ½ΡΡ ΡΠ°ΡΡΠ΅ΡΠ½ΡΡ ΠΎΠ±Π»Π°ΡΡΡ Π΄Π»Ρ ΠΏΡΠ΅Π΄ΡΡΠ°Π²Π»Π΅Π½ΠΈΡ ΠΊΠ°ΠΊ ΡΡΠ΅ΡΠΈΠ½Ρ, ΡΠ°ΠΊ ΠΈ ΠΊΠΎΠ»Π»Π΅ΠΊΡΠΎΡΠ°, ΠΈ ΡΡΡΡΠ°Π½ΡΠ΅Ρ Π½Π΅ΠΎΠ±Ρ
ΠΎΠ΄ΠΈΠΌΠΎΡΡΡ ΡΠ²Π½ΠΎΠΉ ΠΈΠ΄Π΅Π½ΡΠΈΡΠΈΠΊΠ°ΡΠΈΠΈ ΡΡΠ΅ΡΠΈΠ½Ρ. ΠΈ Π½Π°ΠΏΡΠ°Π²Π»Π΅Π½ΠΈΡ ΡΠ°ΡΠΏΡΠΎΡΡΡΠ°Π½Π΅Π½ΠΈΡ. Π ΠΏΡΠΎΡΠ΅ΡΡΠ΅ ΠΈΡΡΠ»Π΅Π΄ΠΎΠ²Π°Π½ΠΈΡ Π±ΡΠ»Π° ΡΠ°ΡΡΠΌΠΎΡΡΠ΅Π½Π° Π³ΡΡΠΏΠΏΠ° ΡΠ»ΠΎΠΆΠ½ΡΡ
ΠΌΠ°ΡΠ΅ΠΌΠ°ΡΠΈΡΠ΅ΡΠΊΠΈΡ
ΠΌΠΎΠ΄Π΅Π»Π΅ΠΉ Π΄Π΅ΡΠΎΡΠΌΠ°ΡΠΈΠΈ.The object of the study is an oil field with low permeability, where hydraulic fracturing was carried out in order to increase oil production. The aim of the work is to develop a simulation model of hydraulic fracturing using a variational approach to hydraulic fracturing as a mechanical model, which allows using a single computational domain to represent both the fracture and the reservoir, and eliminates the need for explicit fracture identification. and directions of distribution.
In the course of the study, a group of complex mathematical models of deformation and fluid flow was considered
Raman investigation of stress and phase transformation induced in silicon by indentation at high temperatures
To study the material deterioration at and around the
support contacts during processing of silicon wafers, we used
Rockwell indentation at elevated temperatures as a model.
Cz-silicon was subjected for 30 s to a load of 1.5 N, at
temperatures between 70Β Β°C and 660Β Β°C. The
resulting morphology was checked by Scanning Electron Microscopy.
Micro Raman Spectroscopy was used to monitor residual stress and the
occurrence of silicon polymorphs. We found strong compressive
stress inside the indented area, with a dramatic drop and reversal
to tensile stress at its boundary. The morphology shows a top hat
profile, covered with a mesh of vein-like structures. Crystalline
phases such as Si-III, Si-IV, Si-XII, and amorphous silicon are
observed. Outside the spot, the situation depends strongly on the
indentation temperature. Up to 400Β Β°C the material appears
practically unstressed, with a high density of relaxation cracks.
At 500Β Β°C and 600Β Β°C a transition is found from
strong tensile stress at the boundary to another region of compressive
stress extending over more than 40Β ΞΌm, associated with a
significantly lower crack density. At still higher temperature
(660Β Β°C) the crack density tends to zero, and comparably weak
stress seams to oscillate between compressive and tensile
Pulsed laser deposition of HfO 2 and Pr x O y high-k films on Si(100)
Abstract Pulsed laser deposition was used to grow thin films of the high-k materials praseodymium oxide (Pr x O y ) and hafnium oxide (HfO 2 ) on Si(100) due to its experimental simplicity and flexibility. Most important factors for technical application, such as film morphology and interface quality, were investigated by optical microscopy, atomic force microscopy and Raman spectroscopy. During the growth process typical splashes, originating from the laser-target interaction, are embedded into the growing layer. The size of these splashes appears to depend strongly on the laser wavelength (355, 532, 1064 nm). The microscopic morphology of layers of both materials shows a dependence on substrate temperature, which is much more pronounced in case of HfO 2 . Raman spectra of the films show relatively sharp phonon peaks, a single one for Pr x O y and a rich spectrum for HfO 2 , clearly evidencing crystalline areas. This is corroborated by substrate Raman spectra which indicate a stressed interface, pointing to epitaxial Pr x O y and HfO 2 film growth, respectively, during the initial stages of growth.
Quantitative Photoelastic Characterization of Residual Strains in Grains of Multicrystalline Silicon
Evaluation of Stress and Crystal Quality in Si During Shallow Trench Isolation by UV-Raman Spectroscopy
Stress and phase purity analyses of diamond films deposited through laser-assisted combustion synthesis
Diamond films were deposited on silicon and tungsten carbide substrates in open air through laser-assisted combustion synthesis. Laser-induced resonant excitation of ethylene molecules was achieved in the combustion process to promote diamond growth rate. In addition to microstructure study by scanning electron microscopy, Raman spectroscopy was used to analyze the phase purity and residual stress of the diamond films. High-purity diamond films were obtained through laser-assisted combustion synthesis. The levels of residual stress were in agreement with corresponding thermal expansion coefficients of diamond, silicon, and tungsten carbide. Diamond-film purity increases while residual stress decreases with an increasing film thickness. Diamond films deposited on silicon substrates exhibit higher purity and lower residual stress than those deposited on tungsten carbide substrates