Technologies for 3D Heterogeneous Integration

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this integration technology, the fundamental processing steps will be described, as well as appropriate handling concepts. Three main concepts for 3D integration have been developed at IZM. The approach with the greatest flexibility called Inter Chip Via - Solid Liquid Interdiffusion (ICV-SLID) is introduced. This is a chip-to-wafer stacking technology which combines the advantages of the Inter Chip Via (ICV) process and the solid-liquid-interdiffusion technique (SLID) of copper and tin. The fully modular ICV-SLID concept allows the formation of multiple device stacks. A test chip was designed and the total process sequence of the ICV-SLID technology for the realization of a three-layer chip-to-wafer stack was demonstrated. The proposed wafer-level 3D integration concept has the potential for low cost fabrication of multi-layer high-performance 3D-SoCs and is well suited as a replacement for embedded technologies based on monolithic integration. To address yield issues a wafer-level chip-scale handling is presented as well, to select known-good dies and work on them with wafer-level process sequences before joining them to integrated stacks.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838

Reliability of Through Silicon Via Technologies - an Invited Talk

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(Invited) Reliability of Through Silicon Via Technologies

A lot of technologies are suggested to build up 3-dimensional integrated systems. Due to the relatively short history of 3D-integration attempts most of these technologies are still far away of being mature modules. After a period of time with public relation for 3D-integration by presenting new technological results, now it is necessary to turn attention towards practicability and value for products. The key word is reliability</jats:p

3D Integration Technology as an Alternative to "More Moore"

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Enzymatic Sensor Based on Dye Sensitized TiO₂ Electrode for Detection of Catechol in Water

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3D System Integration

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this integration technology, the fundamental concepts will be described, as well as appropriate handling concepts

Towards Low Cost and Low Temperature Capacitive CO2 Sensors Based on Amine Functionalized Silica Nanoparticles

Hybrid materials based on inorganic particles and an organic polymer were developed and used as an efficient sensing material for carbon dioxide (CO2). The sensing material consists of fumed silica that is functionalized with an organic polymer, polyethylenimine, by means of the impregnation method. The organic polymer is effectively immobilized around the silica nanoparticles and confirmed by infrared spectroscopy. Thermogravimetric analysis proves the thermal stability of the sensing material. CO2 capacitive sensors operating at temperatures lower than 70 &deg;C were fabricated by depositing a thin layer of hybrid sensing material on interdigitated gold electrodes. Impedance spectroscopy explored the sensing capability of the hybrid organic&ndash;inorganic material towards CO2 in the presence of different relative humidity levels, as well as its stability and reversibility. This strategy to couple organic and inorganic materials as a sensing layer for CO2 paves the way for the design of a low-cost CO2 sensor