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6 research outputs found
A Comparison of Grain Size Measurements in Al-Cu Thin Films: Imaging verses Diffraction Techniques
Author
C.E. Murray
K.P. Rodbell
L.M. Gignac
M. Gribelyuk
Publication venue
'Cambridge University Press (CUP)'
Publication date
Field of study
No full text
Crossref
The microstructure, mechanical stress, texture, and electromigration behavior of Al-Pd alloys
Author
D. B. Knorr
D.-Y. Shih
+22 more
D.B. Knorr
D.B. Knorr
D.B. Knorr
D.R. Frear
D.R. Frear
D.S. Gardner
I. Ames
J. D. Mis
J.E. Sanchez
J.K. Howard
K. P. Rodbell
K.N. Tu
K.P. Rodbell
K.P. Rodbell
P.A. Flinn
R. Rosenberg
R. Venkatraman
S. Vaidya
S.A. Lytle
T. Kwok
T.D. Sullivan
U. Koster
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Texture enhancement of Al films on Ti underlayers by radio-frequency bias sputtering
Author
B.S. Eun
D.B. Knorr
+18 more
D.B. Knorr
D.P. Tracy
D.S. Gardner
D.S. Park
Duk-Seo Park
H. Shibata
H.H. Hoang
H.T. Jeong
J.K. Howard
K. Kamoshida
K. Lee
K.P. Rodbell
M. Marinnov
S. Vaidya
S. Yoo
T. Mitsuzuka
T. Sasaki
Young-Ho Kim
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Local textures and grain boundaries in voided copper interconnects
Author
D. P. Field
D. Turnbull
+19 more
D.B. Knorr
D.H. Warrington
D.P. Field
D.P. Field
H. Gleiter
J. A. Nucci
J.A. Nucci
J.A. Nucci
J.T. Yue
K.P. Rodbell
P. Børgesen
R. R. Keller
R.P. Vinci
R.P. Vinci
S. Kordic
S.C. Wardle
V. Randle
V. Randle
W.T. Read
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Effect of multistep annealing on mechanical and surface properties of electroplated Cu thin films
Author
A. Furuya
A. K. Sikder
+25 more
A.K. Sikder
A.K. Sikder
Ashok Kumar
C-Y. Yang
C. Lingk
C. Lingk
H. Lee
H.K. Kang
J. Proost
J. Tao
J.M. Harper
K. Ueno
K.P. Rodbell
L. Vanasupa
M. Sanganaria
M.F. Doerner
M.T. Perez-Prado
P. B. Zantye
P. Shukla
S. Lagrange
S.H. Brongersma
S.H. Kang
S.M. Merchant
T.-H. Fang
W.H. The
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Microstructural characterization of inlaid copper interconnect lines
Author
A. Diebold
A. Huot
+53 more
A. Tezaki
A.N. Campbell
Brett Baker
C. Lingk
C. Lingk
C. Lingk
C. Ryu
Cindy Simpson
Cristiano Capasso
D. Edelstein
D.B. Knorr
D.B. Knorr
D.J. Dingley
D.J. Dingley
D.P. Field
D.P. Field
D.P. Tracy
Delrose Winter
E. Zschech
E.M. Zielinski
Ehrenfried Zschech
Elizabeth Weitzman
Greg Braeckelmann
H. Toyoda
Hisao Kawasaki
J. Kasthurirangan
J.A. Venables
J.E. Sanchez
J.M.E. Harper
K.P. Rodbell
L. Vanasupa
Larry Zhao
M. Kageyama
Martin Gall
Matt Herrick
Mike Tiner
P. Besser
P.R. Besser
P.R. Besser
P.R. Besser
P.R. Besser
P.R. Besser
Paul R. Besser
R.P. Vinci
R.P. Vinci
Richard Ortega
S. Vaidya
S. Venkatasen
Stacye Thrasher
Stewart Rose
T. Licata
V. Randle
Werner Blum
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref