Structural and chemical characterization of the back contact region in high efficiency CdTe solar cells

Cadmium telluride (CdTe) is the leading commercialized thin-film photovoltaic technology. Copper is commonly used in back contacts to obtain high efficiency, but has also been implicated as a harmful factor for device stability. T hus it is critical to understand its composition and distribution within complete devices. In this work the composition and structure of the back contact region was examined in high efficiency devices (-16%) contacted using a ZnTe:Cu buffer layer followed by gold metallization. T he microstructure was examined in the asdeposited state and after rapid thermal processing (RTP) using high resolution transmission electron microscopy and EDX chemical mapping. After RTP the ZnTe exhibits a bilayer structure with polycrystalline, twinned grains adjacent to Au and an amorphous region adjacent to CdTe characterized by extensive Cd-Zn interdiffusion. T he copper that is co-deposited uniformly within ZnTe is found to segregate dramatically after RTP activation, either collecting near the ZnTe/Au interface or forming CUxTe clusters in CdTe at defects or grain boundaries near the interface with ZnTe. Chlorine, present throughout CdTe and concentrated at grain boundaries, does not penetrate significantly into the back contact region during RTP activation

The roles of ZnTe buffer layers on CdTe solar cell performance

The use of ZnTe buffer layers at the back contact of CdTe solar cells has been credited with contributing to recent improvements in both champion cell efficiency and module stability. To better understand the controlling physical and chemical phenomena, high resolution transmission electron microscopy (HR-TEM) and atom probe tomography (APT) were used to study the evolution of the back contact region during rapid thermal processing (RTP) of this layer. After activation the ZnTe layer, initially nanocrystalline and homogenous, transforms into a bilayer structure consisting of a disordered region in contact with CdTe characterized by significant Cd-Zn interdiffusion, and a nanocrystalline layer that shows evidence of grain growth and twin formation. Copper, co-evaporated uniformly within ZnTe, is found to dramatically segregate and aggregate after RTP, either collecting near the ZnTe|Au interface or forming CuxTe clusters in the CdTe layer at defects or grain boundaries near the interface. Analysis of TEM images revealed that Zn accumulates at the edge of these clusters, and three-dimensional APT images confirmed that these are core-shell nanostructures consisting of Cu1.4Te clusters encased in Zn. These changes in morphology and composition are related to cell performance and stability