Integrated Piezoelectric AlN Thin Film with SU-8/PDMS Supporting Layer for Flexible Sensor Array

This research focuses on the development of a flexible tactile sensor array consisting of aluminum nitride (AlN) based on micro-electro-mechanical system (MEMS) technology. A total of 2304 tactile sensors were integrated into a small area of 2.5 × 2.5 cm2. Five hundred nm thick AlN film with strong c-axis texture was sputtered on Cr/Au/Cr (50/50/5 nm) layers as the sacrificial layer coated on a Si wafer. To achieve device flexibility, polydimethylsiloxane (PDMS) polymer and SU-8 photoresist layer were used as the supporting layers after etching away a release layer. Twenty-five mM (3-mercaptopropyl) trimethoxysilane (MPTMS) improves the adhesion between metal and polymers due to formation of a self-assembled monolayer (SAM) on the surface of the top electrode. The flexible tactile sensor has 8 × 8 channels and each channel has 36 sensor elements with nine SU-8 bump blocks. The tactile sensor array was demonstrated to be flexible by bending 90 degrees. The tactile sensor array was demonstrated to show clear spatial resolution through detecting the distinct electrical response of each channel under local mechanical stimulus. © 2020 by the authors. Licensee MDPI, Basel, Switzerland.1

Fabrication of a two-dimensional piezoelectric micromachined ultrasonic transducer array using a top-crossover-to-bottom structure and metal bridge connections

A new design methodology and fabrication process for two-dimensional (2D) piezoelectric micromachined ultrasonic transducer (pMUT) arrays using a top-crossover-to-bottom (TCTB) structure was developed. Individual sensing and actuation of pMUT elements from a small number of connection lines was enabled by the TCTB structure, and the parasitic coupling capacitance of the array was significantly reduced as a result. A 32 × 32 pMUT array with a TCTB structure was fabricated, resulting in 64 connection lines over an area of 4.8 × 4.8 mm2. The top electrodes for each pMUT element were re-connected by metal bridging after bottom-electrode etching caused them to become disconnected. A deep reactive ion etching process was used to compactify the array. Each pMUT element was a circular-shaped K31-type ultrasonic transducer using a 1 μm thick sol-gel lead zirconate titanate (PZT: Pb1.10 Zr0.52 Ti0.48) thin film. To characterize a single element in the 2D pMUT array, the resonant frequency and coupling coefficient of 20 pMUT elements were averaged to 3.85 MHz and 0.0112, respectively. The maximum measured ultrasound intensity in water, measured at a distance of 4 mm, was 4.6 μW cm-2 from a single pMUT element driven by a 5 Vpp sine wave at 2.22 MHz. Potential applications for development of a TCTB-arranged 2D pMUT array include ultrasonic medical imaging, ultrasonic communication, ultrasonic range-finding and handwriting input systems. © 2013 IOP Publishing Ltd.1

A top-crossover-to-bottom addressed segmented annular array using piezoelectric micromachined ultrasonic transducers

We design and fabricate segmented annular arrays (SAAs) using piezoelectric micromachined ultrasonic transducers (pMUTs) to demonstrate the feasibility of acoustic focusing of ultrasound. The fabricated SAAs have 25 concentric top-electrode signal lines and eight bottom-electrodes for grounding to enable electronic steering of selectively grouped ultrasonic transducers from 2393 pMUT elements. Each element in the array is connected by top-crossover-to-bottom metal bridges, which reduce the parasitic capacitance. Circular-shaped pMUT elements, 120 μm in diameter, are fabricated using 1 μm-thick sol-gel lead zirconate titanate on a silicon wafer. To utilize the high-density pMUT array, a deep reactive ion etching process is used for anisotropic silicon etching to realize the transducer membranes. The resonant frequency and effective coupling coefficient of the elements, measured with an impedance analyzer, yields 1.517 MHz and 1.29%, respectively, in air. The SAAs using pMUTs are packaged on a printed circuit board and coated with parylene C for acoustic intensity measurements in water. The ultrasound generated by each segmented array is focused on a selected point in space. When a 5 Vpp, 1.5 MHz square wave is applied, the maximum spatial peak temporal average intensity () is found to be 79 mW cm-2 5 mm from the SAAs' surface without beamforming. The beam widths (-3 dB) of ultrasonic radiation patterns in the elevation and azimuth directions are recorded as 3 and 3.4 mm, respectively. The results successfully show the feasibility of focusing ultrasound on a small area with SAAs using pMUTs. © 2015 IOP Publishing Ltd.1

31-mode piezoelectric micromachined ultrasonic transducer with PZT thick film by granule spraying in vacuum process

A piezoelectric micromachined ultrasonic transducer (pMUT) is an ideal device for portable medical diagnosis systems, intravascular ultrasound systems, and ultrasonic cameras because of its favorable characteristics including small size, acoustic impedance matching with the body, low power consumption, and simple integration with the systems. Despite these advantages, practical applications are limited because of insufficient acoustic pressure of the pMUT caused by the thin active piezoelectric layer. Here, we report the fabrication of a thick piezoelectric Pb(Zr,Ti)O3 (PZT) film-based pMUT device having high deflection at low driving voltage using the granule spraying in vacuum (GSV) process. Pre-patterned high-density thick (exceeding 8 μm) PZT films were grown on 6-inch-diameter Si/SiO2/Ti/Pt silicon-on-insulator wafers at room temperature at a high deposition rate of ∼5 μm min-1. The fabrication process using the proposed GSV process was simple and fast, and the deflection of the pMUT exhibited a high value of 0.8 μm. © 2017 Author(s).1

FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays

An acoustic matching layer is an essential component of an ultrasound transducer to achieve maximum ultrasound transmission efficiency. Here, we develop a flexible printed circuit board (FPCB) with a composite structure consisting of multiple polyimide and copper layers and demonstrate it as a novel acoustic matching layer. With a flexible substrate and robust ACF bonding, the FPCB not only serves as an acoustic matching layer between piezoelectric elements and the surrounding medium but also as a ground for the electrical connection between the transducer array elements and the folded substrate. A 1D linear ultrasound transducer array with the FPCB matching layer exhibits larger output pressure, wider -3dB bandwidth, and higher ultrasound beam intensity compared to that of an ultrasound transducer array with the alumina/epoxy matching layer, which is one of the most commonly applied composite matching layers. The enhanced transmission performance verifies that the proposed FPCB is an excellent matching layer for 1D linear ultrasound transducer arrays

Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter

Most microsensors are composed of devices and covers. Due to the complicated structure of the cover and various other requirements, it difficult to use wafer-level packaging with such microsensors. In particular, for monolithic microsensors combined with read-out ICs, the available process margins are further reduced due to the thermal and mechanical effects applied to IC wafers during the packaging process. This research proposes a low-temperature, wafer-level vacuum packaging technology based on Cu-Sn bonding and nano-multilayer getter materials for use with microbolometers. In Cu-Sn bonding, the Cu/Cu3Sn/Cu microstructure required to ensure reliability can be obtained by optimizing the bonding temperature, pressure, and time. The Zr-Ti-Ru based nanomultilayer getter coating inside the cap wafer with high step height has been improved by self-aligned shadow masking. The device pad, composed of bonded wafer, was opened by wafer grinding, and the thermoelectrical properties were evaluated at the wafer-level. The bonding strength and vacuum level were characterized by a shear test and thermoelectrical test using microbolometer test pixels. The vacuum level of the packaged samples showed very narrow distribution near 50 mTorr. This wafer-level packaging platform could be very useful for sensor development whereby high reliability and excellent mechanical/optical performance are both required. Due to its reliability and the low material cost and bonding temperature, this wafer-based packaging approach is suitable for commercial applications