A micromachined flow shear-stress sensor based on thermal transfer principles

Microhot-film shear-stress sensors have been developed by using surface micromachining techniques. The sensor consists of a suspended silicon-nitride diaphragm located on top of a vacuum-sealed cavity. A heating and heat-sensing element, made of polycrystalline silicon material, resides on top of the diaphragm. The underlying vacuum cavity greatly reduces conductive heat loss to the substrate and therefore increases the sensitivity of the sensor. Testing of the sensor has been conducted in a wind tunnel under three operation modes-constant current, constant voltage, and constant temperature. Under the constant-temperature mode, a typical shear-stress sensor exhibits a time constant of 72 μs

Characteristics of virtual unipolar electrograms for detecting isthmus block during radiofrequency ablation of typical atrial flutter

AbstractObjectivesThe purpose of this study was to investigate the characteristics of the second component of local virtual unipolar electrograms recorded at the ablation line during coronary sinus (CS) pacing after radiofrequency ablation (RFA) of the cavotricuspid isthmus (CTI) for typical atrial flutter (AFL).BackgroundRadiofrequency ablation of the CTI can produce local double potentials at the ablation line. The second component of unipolar electrograms represents the approaching wavefront in the right atrium opposite the pacing site. We hypothesized that the morphologic characteristics of the second component of double potentials would be useful in detecting complete CTI block.MethodsRadiofrequency ablation of the CTI was performed in 52 patients (males = 37, females = 15, 62 ± 12 years) with typical AFL. The noncontact mapping system (Ensite 3000, Endocardial Solutions, St. Paul, Minnesota) was used to guide RFA. Virtual unipolar electrograms along the ablation line during CS pacing after RFA were analyzed. Complete or incomplete CTI block was confirmed by the activation sequence on the halo catheter and noncontact mapping.ResultsThree groups were classified after ablation. Group I (n = 37) had complete bidirectional CTI block. During CS pacing, the second component of unipolar electrograms showed an R or Rs pattern. Group II (n = 12) had incomplete CTI block. The second component of unipolar electrograms showed an rS pattern. Group III (n = 3) had complete CTI block with transcristal conduction. The second component of unipolar electrograms showed an rSR pattern.ConclusionsA predominant R-wave pattern in the second component of unipolar double potentials at the ablation line indicates complete CTI block, even in the presence of transcristal conduction

Muon anomalous magnetic dipole moment in the μν\mu\nuSSM

Recently, the Muon g-2 experiment at Fermilab has measured the muon anomalous magnetic dipole moment (MDM), which reported that the new experimental average increases the tension between experiment and the standard model (SM) prediction to 4.2 standard deviations, after combination with the previous Brookhaven National Laboratory (BNL) E821 measurement. In this work, we reanalyse the muon anomalous MDM at two-loop level in the $\mu$ from $\nu$ Supersymmetric Standard Model ($\mu\nu$SSM) combined with the updated experimental average. The $\mu\nu$SSM can explain the current tension between the experimental measurement and the SM theoretical prediction for the muon anomalous MDM, constrained by the 125 GeV Higgs boson mass and decays, the rare decay $\bar{B}\rightarrow X_s\gamma$ and so on.Comment: 14 pages, 3 figures. arXiv admin note: substantial text overlap with arXiv:2002.04370, arXiv:2011.0428

Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists

A novel plastic packaging of a piezoresistive pressure sensor using a patterned ultra-thick photoresist is experimentally and theoretically investigated. Two pressure sensor packages of the sacrifice-replacement and dam-ring type were used in this study. The characteristics of the packaged pressure sensors were investigated by using a finite-element (FE) model and experimental measurements. The results show that the thermal signal drift of the packaged pressure sensor with a small sensing-channel opening or with a thin silicon membrane for the dam-ring approach had a high packaging induced thermal stress, leading to a high temperature coefficient of span (TCO) response of −0.19% span/°C. The results also show that the thermal signal drift of the packaged pressure sensors with a large sensing-channel opening for sacrifice-replacement approach significantly reduced packaging induced thermal stress, and hence a low TCO response of −0.065% span/°C. However, the packaged pressure sensors of both the sacrifice-replacement and dam-ring type still met the specification −0.2% span/°C of the unpackaged pressure sensor. In addition, the size of proposed packages was 4 × 4 × 1.5 mm3 which was about seven times less than the commercialized packages. With the same packaging requirement, the proposed packaging approaches may provide an adequate solution for use in other open-cavity sensors, such as gas sensors, image sensors, and humidity sensors

Micro thermal shear stress sensor with and without cavity underneath

Micro hot-film shear-stress sensors have been designed and fabricated by surface micromachining technology compatible with IC technology. A poly-silicon strip, 2 µm x 80 µm, is deposited on the top of a thin silicon nitride film and functions as the sensor element. By using sacrificial-layer technique, a cavity (vacuum chamber), 200 x 200 x 2 µm^3, is placed between the silicon nitride film and silicon substrate. This cavity significantly decreases the heat loss to the substrate. For comparison purposes, a sensor structure without a cavity has also been designed and fabricated on the same chip. Theoretical analyses for the two vertical structures with and without a cavity show that the former has a lower frequency response and higher sensitivity than the latter. When the sensor is operated in constant temperature mode, the cut-off frequencies can reach 130 k-Hz and 9 k-Hz respectively for the sensors without and with cavities

Comparison of Cloud Base Height Derived from a Ground-Based Infrared Cloud Measurement and Two Ceilometers

The cloud base height (CBH) derived from the whole-sky infrared cloud-measuring system (WSIRCMS) and two ceilometers (Vaisala CL31 and CL51) from November 1, 2011, to June 12, 2012, at the Chinese Meteorological Administration (CMA) Beijing Observatory Station are analysed. Significant differences can be found by comparing the measurements of different instruments. More exactly, the cloud occurrence retrieved from CL31 is 3.8% higher than that from CL51, while WSIRCMS data shows 3.6% higher than ceilometers. More than 75.5% of the two ceilometers’ differences are within ±200 m and about 89.5% within ±500 m, while only 30.7% of the differences between WSIRCMS and ceilometers are within ±500 m and about 55.2% within ±1000 m. These differences may be caused by the measurement principles and CBH retrieval algorithm. A combination of a laser ceilometer and an infrared cloud instrument is recommended to improve the capability for determining cloud occurrence and retrieving CBHs