Mechanism of crack propagation for K9 glass

In order to study the mechanism of crack propagation, the varied cutting-depth scratch experiment is carried out and smoothed particle hydrodynamics (SPH) simulation method is used to assistant the investigation. The SPH simulation results reveal that crack will propagate in the direction where stress concentration exceeds the fracture toughness of K9 glass. The initial crack length in critical transition depth is calculated by combining the critical stress of fracture and the fracture toughness of K9 glass. Based on the effective plastic strain, the relation between scratching depth and crack depth is obtained. The recovery of crack tip is found and explained from the relationship between cutting depth and crack depth. Using the energy balance theory of Griffith, the variation of material internal energy is revealed. Comparing the scratching forces obtained from experiment and simulation, the validity of simulation results is verified. The phenomenon of crack delayed propagation is found in both experiment and simulation. The explanation of mechanism is given

Study on the subsurface damage mechanism of optical quartz glass during single grain scratching

The single grain scratching SPH simulation model was established to study the subsurface damage of optical quartz glass. Based on the analysis of the stress, strain and scratching force during scratching, the generation and propagation of subsurface cracks were studied by combining with the scratch elastic stress field model. The simulation results show that the cracks generate firstly at the elastic-plastic deformation boundary in front of the grain (φ = 28°) due to the influence of the maximum principal tensile stress. During the scratching process, the median crack closes to form the subsurface damage by extending downward, the lateral crack promotes the brittle removal of the material by extending upward to the free surface, and microcracks remain in the elastic-plastic boundary at the bottom of the scratch after scratching. The depth of subsurface crack and plastic deformation increases with rising scratching depth. The increase of scratching speed leads to the greater dynamic fracture toughness, accompanied by a significant decrease of the maximum depth of subsurface crack and the number of subsurface cracks. The subsurface residual stress is concentrated at the bottom of the scratch, and the residual stress on both sides of the scratch surface would generate and propogate the Hertz crack. When the scratching depth is less than 1.5 μm or the scratching speed is greater than 75 m/s, the residual stress value and the depth of residual stress are relatively small. Finally, the scratching experiment was carried out. The simulation analysis is verified to be correct, as the generation and propagation of the cracks in the scratching experiment are consistent with the simulation analysis and the experimental scratching force indicates the same variation tendency with the simulation scratching force. The research results in this paper could help to restrain the subsurface damage in grinding process

Smoothed-particle hydrodynamics investigation on brittle–ductile transition of quartz glass in single-grain grinding process

The smoothed-particle hydrodynamics (SPH) method was introduced to simulate the quartz glass grinding process with a single grain under micro-nano scale. To investigate the mechanism of brittle–ductile transition, such factors as the machining depth, grinding force, maximum equivalent stress, and residual stress were analyzed. The simulation results indicate that quartz glass can be machined in a ductile mode under a certain condition. In this paper, the occurrence and propagation of cracks in quartz glass at different grinding depths (0.1–1 μm) are observed, and the critical depth of brittle–ductile transformation is 0.36 μm. At different grinding depths, the grinding force ratio is greater than 1. When the cutting depth is 0.4 μm, the crack propagation depth is about 1.2 μm, which provides a basis for the prediction of subsurface damage depth. In addition, the correctness of the simulation result was verified by carrying out scratch experiments of varying cutting depth on optical quartz glass

Study on electrochemical mechanical polishing process of silicon carbide crystal

To solve the problem of low polishing efficiency of silicon carbide crystal, electrochemical mechanical polishing (ECMP) of silicon carbide was carried out to study the effect of NaOH, NaNO3 and H3PO4 electrolytes on electrochemical oxidation of silicon carbide. NaNO3 of 0.6 mol/L was selected as the electrolyte in the ECMP process and so were the diamond-alumina mixed abrasive particles. The influence of load, rotational speed, voltage and particle size on the surface quality and material removal rate of ECMP silicon carbide was studied by using orthogonal experiment. With the optimized processing parameters, the combined polishing experiment can achieve a high-efficiency material removal rate of 20.259 μm/h in the rough polishing stage, and finally obtain the surface roughness of Sa 0.408 nm through precision polishing

The Effects of Pulse Parameters on Weld Geometry and Microstructure of a Pulsed Laser Welding Ni-Base Alloy Thin Sheet with Filler Wire

Due to its excellent resistance to corrosive environments and its superior mechanical properties, the Ni-based Hastelloy C-276 alloy was chosen as the material of the stator and rotor cans of a nuclear main pump. In the present work, the Hastelloy C-276 thin sheet 0.5 mm in thickness was welded with filler wire by a pulsed laser. The results indicated that the weld pool geometry and microstructure were significantly affected by the duty ratio, which was determined by the pulse duration and repetition rate under a certain heat input. The fusion zone area was mainly affected by the duty ratio, and the relationship was given by a quadratic polynomial equation. The increase in the duty ratio coarsened the grain size, but did not obviously affect microhardness. The weld geometry and base metal dilution rate was manipulated by controlling pulsed parameters without causing significant change to the performance of the weld. However, it should be noted that, with a larger duty ratio, the partial molten zone is a potential weakness of the weld