Endometrial regeneration in Asherman's syndrome and endometrial atrophy using Wharton’s jelly-derived mesenchymal stem cells

Objectives: Reconstruction of the endometrium in patients with endometrial atrophy and Asherman’s syndrome using Wharton’s jelly-derived mesenchymal stem cells (WJ-MSCs). Material and methods: Prospective pilot study, with the inclusion of two patients. Results: After administration of WJ-MSCs into the uterine cavity, endometrial reconstruction was achieved in both patients.  Pregnancy was achieved in one of them, after transfer of a frozen embryo, completed by delivery around the due date. Conclusions: Endometrial atrophy and Asherman’s syndrome, is one of the most frustrating clinical situations we face in assisted reproductive procedures. The use of Wharton’s jelly-derived mesenchymal stem cells in restoring the normal function of the endometrium, could become an easy and accessible therapeutic medal, for this endometrial dysfunction, which is so difficult to treat

Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

Copper sinter paste has been recently established as a robust die-attach material for high -power electronic packaging. This paper proposes and studies the implementation of copper sinter paste materials to create top-side interconnects, which can substitute wire bonds in power packages. Here, copper sinter paste was exploited as a fully printed interconnect and, additionally, as a copper clip-attach. The electrical and thermal performances of the copper-sinter paste interconnections (“sinterconnects”) were compared to a system with wire bonds. The results indicate comparable characteristics of the sinterconnect structures to the wire-bonded ones. Moreover, the performance of copper sinterconnects in a power module was further quantified at higher load currents via finite element analysis. It was identified that the full-area thermal and electrical contact facilitated by the planar sinterconnects can reduce ohmic losses and enhance the thermal management of the power packages