Struktur Keuangan dan Kebijaksanaan Moneter di Asia Tenggara

xv, 349 hlm.; 20 c

Formation and characterization of DLC:Cr:Cu multi-layers coating using cathodic arc evaporation

Chromium and copper-doped diamond-like carbon (DLC:Cr:Cu) films were deposited on SKH 51 tool steel. We have prepared multilayers of DLC:Cr and DLC:Cu by cathodic arc evaporation process using chromium (Cr) and copper (Cu) target arc sources to provide Cr and Cu in the DLC. Acetylene reactive gases were also activated at a pressure of 5 mTorr to 25 mTorr and a temperature fixed at 180 degrees C to provide the DLC. The resulting DLC:Cr:Cu film contained Cr(x)Cu(y) as well as Cr(x)C(y) nanoparticles vital for the film mechanical properties. The crystal structure was investigated using X-ray diffraction (XRD) and transmission electron microscopy, while the surface morphology and chemical composition were studied by field emission scanning electron microscopy and X-ray photoelectron spectroscopy. The process parameters were compared by studying the various mechanical properties of the films such as microhardness and residual stress. The result of this process enhanced the DLC:Cr:Cu composite coatings for high toughness and lower friction coefficient (0.08). The profiles of sp(3)/sp(2) (XPS) ratios corresponded to the change of microhardness profile by varying the pressure of the hydrocarbon gases (C(2)H(2)). Crown Copyright (C) 2008 Published by Elsevier B.V. All rights reserved

Bias voltage effect on the structure and property of chromium copper-diamond-like carbon multilayer films fabricated by cathodic arc plasma

Chromium copper-diamond-like carbon (Cr:Cu)-DLC films were deposited onto silicon and by cathodic arc evaporation process using chromium (Cr) and copper (Cu) target arc sources to provide Cr and Cu in the Me-DLC. Acetylene reactive gases were the carbon source and activated at 180 degrees C at 13 mTorr, and a substrate bias voltage was varied from -50V to -200V to provide the (Cr:Cu)-DLC structure. The structure, interface, and chemical bonding state of the produced film were analyzed by transmission electron microscope (TEM), IR Fourier transform (FTIR) spectra, and X-ray photoelectron spectroscopy (XPS). The results showed that the Cr-containing a-C:H/Cu coatings exhibited an amorphous layer of DLC:Cr layer and a crystalline layer of Cu multilayer structure. The profiles of sp(3)/sp(2) (XPS) ratios corresponded to the change of microhardness profile by varying the pressure of the negative DC bias voltage. These (Cr:Cu)-DLC coatings are promising materials for soft substrate protective coatings. Crown Copyright (C) 2010 Published by Elsevier B.V. All rights reserved