Materials analysis of fluorocarbon films for MEMS applications

In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results are presente

Seedless electroplating on patterned silicon

Nickel thin films have been electrodeposited without the use of an additional\ud seed layer, on highly doped silicon wafers. These substrates conduct\ud sufficiently well to allow deposition using a peripherical electrical contact on\ud the wafer. Films 2 μm thick have been deposited using a nickel sulfamate\ud bath on both n+- and p+-type silicon wafers, where a series of trenches with\ud different widths had been previously etched by plasma etching. A new,\ud reliable and simple procedure based on the removal of the native oxide layer\ud is presented which allows uniform plating of patterned substrates

Wafer scale nano-membranes supported on a silicon microsieve

A new micromachining method to fabricate wafer scale, atomically smooth nano-membranes is described. The delicate membrane is supported on a robust silicon microsieve fabricated by plasma etching. The supporting sieve is micromachined independently of the nano-membrane, which is later fusion bonded to it. The transferred thin-film membrane can be dense, porous or perforated according to the application desired. One of the main application areas for such membranes is in fluidics, where the small thickness and high strength of the supported nano-membranes is a big advantage. The novel method described enables to easily up-scale and interface micro or nano-membranes to the macro-worl

Deemo: a new technology for the fabrication of microstructures

The recent innovations in dry etching make it a promising technology for the fabrications of micromoulds. The high aspect ratios, directional freedom, low roughness, high etch rates and high selectivity with respect to the mask material allow a versatile fabrication process of micromoulds for subsequent electroplating and embossing, as is demonstrated with the DEEMO process. DEEMO is an English acronym and stands for Dry Etching, Electroplating and Moulding

Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process

Many micro electromechanical systems (MEMS) require a vacuum or controlled atmosphere encapsulation in order to ensure either a good performance or an acceptable lifetime of operation. Two approaches for wafer-scale zero-level packaging exist. The most popular approach is based on wafer bonding. Alternatively, encapsulation can be done by the fabrication and sealing of perforated surface micromachined membranes. In this paper, a sealing method is proposed for zero-level packaging using a thin film reflow technique. This sealing method can be done at arbitrary ambient and pressure. Also, it is self-aligned and it can be used for sealing openings directly above the MEMS device. It thus allows for a smaller die area for the sealing ring reducing in this way the device dimensions and costs. The sealing method has been demonstrated with reflowed aluminium, germanium, and boron phosphorous silica glass. This allows for conducting as well as non-conducting sealing layers and for a variety of allowable thermal budgets. The proposed technique is therefore very versatile

Design of a cold gas micro thruster

Keywords: Micro satellites, Micro propulsion, MEMS technologie

Characterization of a planar microcoil for implantable microsystems

This paper discusses the modelling, design and characterization of planar microcoils to be used in telemetry systems that supply energy to miniaturized implants. Parasitic electrical effects that may become important at a.c. frequencies of several megahertz are evaluated. The fabrication process and electrical characterization of planar receiver microcoils will be described, and it will be shown that a power of a few milliwatts is feasible.\u