21 research outputs found
Π’Π΅Ρ Π½ΠΈΠΊΠΎ-ΡΠΊΠΎΠ½ΠΎΠΌΠΈΡΠ΅ΡΠΊΠΎΠ΅ ΠΎΠ±ΠΎΡΠ½ΠΎΠ²Π°Π½ΠΈΠ΅ ΡΡ Π΅ΠΌ ΡΠ΅Π΄ΡΡΠΈΡΠΎΠ²Π°Π½ΠΈΡ Π³Π°Π·Π°
Dynamics of streamer discharge development in semiconductors
Space-time dynamics of streamer discharges in semiconductors in view of processes of shock (tunnel and photo-) ionization, radiating spontaneous and stimulated recombination as well as electron-photon interaction in a strong electric field has been modeled. The possibility of formation in these conditions of space-nonuniform dissipative structures, self-oscillatory regular and other modes were shown; their laws and interrelation with dynamics of streamer laser discharge were established. Nonmonotonic dependence of system characteristics on key parameters - excitation rate, life time of nonequilibrium carriers and photons, quantum efficiency of active environment as well as strengthening of structure interaction in conditions of stimulated recombination causing variety of own system dynamics were revealed. Radiating processes provide high speed of structure distribution compared with phase speed of light, and they are the basic generation mechanism of nonequilibrium carriers generation in self-oscillatory mode respective to optimum conditions of streamer occurrence and developmen
ΠΠ΅ΡΠΎΠ΄ CRAMM - ΠΊΠΎΠΌΠΏΠ»Π΅ΠΊΡΠ½ΡΠΉ ΠΏΠΎΠ΄Ρ ΠΎΠ΄ ΠΊ ΠΎΡΠ΅Π½ΠΊΠ΅ ΡΠΈΡΠΊΠΎΠ²
The article shows the use of the method CRAMM for risk management and research of information security systems
Π’Π΅Ρ Π½ΠΎΠ»ΠΎΠ³ΠΈΡΠ΅ΡΠΊΠΈΠ΅ ΡΠ΅ΡΠ΅Π½ΠΈΡ Π΄Π»Ρ ΡΡΡΠΎΠΈΡΠ΅Π»ΡΡΡΠ²Π° ΡΠΊΡΠΏΠ»ΡΠ°ΡΠ°ΡΠΈΠΎΠ½Π½ΠΎΠΉ Π½Π°ΠΊΠ»ΠΎΠ½Π½ΠΎ-Π½Π°ΠΏΡΠ°Π²Π»Π΅Π½Π½ΠΎΠΉ ΡΠΊΠ²Π°ΠΆΠΈΠ½Ρ Π³Π»ΡΠ±ΠΈΠ½ΠΎΠΉ 2775 ΠΌΠ΅ΡΡΠΎΠ² Π½Π° Π½Π΅ΡΡΡΠ½ΠΎΠΌ ΠΌΠ΅ΡΡΠΎΡΠΎΠΆΠ΄Π΅Π½ΠΈΠΈ Π’ΠΎΠΌΡΠΊΠΎΠΉ ΠΎΠ±Π»Π°ΡΡΠΈ
Π¦Π΅Π»Ρ ΡΠ°Π±ΠΎΡΡ β ΠΏΡΠΎΠ΅ΠΊΡΠΈΡΠΎΠ²Π°Π½ΠΈΠ΅ ΡΡΡΠΎΠΈΡΠ΅Π»ΡΡΡΠ²Π° Π½Π°ΠΊΠ»ΠΎΠ½Π½ΠΎ-Π½Π°ΠΏΡΠ°Π²Π»Π΅Π½Π½ΠΎΠΉ ΡΠΊΡΠΏΠ»ΡΠ°ΡΠ°ΡΠΈΠΎΠ½Π½ΠΎΠΉ ΡΠΊΠ²Π°ΠΆΠΈΠ½Ρ Π³Π»ΡΠ±ΠΈΠ½ΠΎΠΉ 2775 ΠΌΠ΅ΡΡΠΎΠ² Π½Π° Π‘ΠΎΠ±ΠΎΠ»ΠΈΠ½ΠΎΠΌ Π½Π΅ΡΡΡΠ½ΠΎΠΌ ΠΌΠ΅ΡΡΠΎΡΠΎΠΆΠ΄Π΅Π½ΠΈΠΈ Π’ΠΎΠΌΡΠΊΠΎΠΉ ΠΎΠ±Π»Π°ΡΡΠΈ.
Π Π΄Π°Π½Π½ΠΎΠΉ ΡΠ°Π±ΠΎΡΠ΅ ΠΏΡΠΈΠ²Π΅Π΄Π΅Π½Ρ Π΄Π°Π½Π½ΡΠ΅ ΠΎ ΠΏΠ°ΡΠ°ΠΌΠ΅ΡΡΠ°Ρ
ΡΠΎΠΎΡΡΠΆΠ΅Π½ΠΈΡ ΡΠΊΠ²Π°ΠΆΠΈΠ½Ρ, ΡΠ°ΡΡΠΌΠΎΡΡΠ΅Π½Ρ ΠΏΡΠΎΡΠ΅ΡΡΡ Π±ΡΡΠ΅Π½ΠΈΡ ΠΈ Π·Π°ΠΊΠ°Π½ΡΠΈΠ²Π°Π½ΠΈΡ ΡΠΊΠ²Π°ΠΆΠΈΠ½, Π²ΡΠ±ΡΠ°Π½ΠΎ ΡΠΎΠΎΡΠ²Π΅ΡΡΡΠ²ΡΡΡΠ΅Π΅ ΠΎΠ±ΠΎΡΡΠ΄ΠΎΠ²Π°Π½ΠΈΠ΅, Π° ΡΠ°ΠΊΠΆΠ΅ Π·Π°ΡΡΠΎΠ½ΡΡΡ Π²ΠΎΠΏΡΠΎΡΡ Π²ΠΎΠ·Π΄Π΅ΠΉΡΡΠ²ΠΈΡ Π½Π° ΠΎΠΊΡΡΠΆΠ°ΡΡΡΡ ΡΡΠ΅Π΄Ρ ΠΈ ΠΎΡΠ΅Π½Π΅Π½Π° ΡΠΊΠΎΠ½ΠΎΠΌΠΈΡΠ΅ΡΠΊΠ°Ρ ΡΡΡΠ΅ΠΊΡΠΈΠ²Π½ΠΎΡΡΡ ΡΡΡΠΎΠΈΡΠ΅Π»ΡΡΡΠ²Π° ΡΠΊΠ²Π°ΠΆΠΈΠ½Ρ. Π Π΄Π°Π½Π½ΠΎΠΉ ΡΠ°Π±ΠΎΡΠ΅ ΡΠ°ΠΊΠΆΠ΅ ΡΠΎΠ΄Π΅ΡΠΆΠ°ΡΡΡ ΠΈΡΡΠ»Π΅Π΄ΠΎΠ²Π°Π½ΠΈΡ Π°Π±ΡΠ°Π·ΠΈΠ²Π½ΠΎΠ³ΠΎ Π²ΠΎΠ·Π΄Π΅ΠΉΡΡΠ²ΠΈΡ ΡΠ²Π΅ΡΠ΄ΠΎΠΉ ΡΠ°Π·Ρ Π±ΡΡΠΎΠ²ΠΎΠ³ΠΎ ΡΠ°ΡΡΠ²ΠΎΡΠ° Π½Π° ΡΠ»Π°ΡΡΠΎΠΌΠ΅ΡΡ Π²ΠΈΠ½ΡΠΎΠ²ΡΡ
Π·Π°Π±ΠΎΠΉΠ½ΡΡ
Π΄Π²ΠΈΠ³Π°ΡΠ΅Π»Π΅ΠΉ Ρ ΡΠ΅Π»ΡΡ ΠΈΡ
ΠΌΠΎΠ΄ΠΈΡΠΈΠΊΠ°ΡΠΈΠΈ. ΠΡΠΏΡΡΠΊΠ½Π°Ρ ΠΊΠ²Π°Π»ΠΈΡΠΈΠΊΠ°ΡΠΈΠΎΠ½Π½Π°Ρ ΡΠ°Π±ΠΎΡΠ° Π²ΡΠΏΠΎΠ»Π½Π΅Π½Π° Ρ ΡΠΏΠΎΡΠΎΠΌ Π½Π° ΡΠΎΠ²ΡΠ΅ΠΌΠ΅Π½Π½ΡΠ΅ Π΄ΠΎΡΡΠΈΠΆΠ΅Π½ΠΈΡ Π² ΠΎΠ±Π»Π°ΡΡΠΈ ΡΡΡΠΎΠΈΡΠ΅Π»ΡΡΡΠ²Π° Π½Π΅ΡΡΡΠ½ΡΡ
ΠΈ Π³Π°Π·ΠΎΠ²ΡΡ
ΡΠΊΠ²Π°ΠΆΠΈΠ½.The aim of the work is the design of the construction of a directional production well with a depth of 2,775 meters at the Sobolinoe oil field in the Tomsk Region. In this paper, data are given on the parameters of well construction, drilling and completion of wells are considered, equipment is selected, and issues related to the economic state of the well are discussed. This paper also contains the results of studies conducted in accordance with the current regulations. Graduation qualification work was carried out with an emphasis on modern achievements in the field of construction of oil and gas wells
Materialabtrag mit intensiven, ultrakurzen Laserpulsen fΓΌr Anwendungen in der Mikrosystemtechnik
Materialabtrag mit intensiven, ultrakurzen Laserpulsen fΓΌr Anwendungen in der Mikrosystemtechnik
ΠΠ΅ΠΉΡΠΎΡΠ²ΠΎΠ»ΡΡΠΈΠΎΠ½Π½ΡΠΉ Π°Π»Π³ΠΎΡΠΈΡΠΌ ΠΈ ΠΏΡΠΎΠ³ΡΠ°ΠΌΠΌΠ½ΡΠ΅ ΡΡΠ΅Π΄ΡΡΠ²Π° Π΄Π»Ρ ΠΎΠ±ΡΠ°Π±ΠΎΡΠΊΠΈ ΠΈΠ·ΠΎΠ±ΡΠ°ΠΆΠ΅Π½ΠΈΠΉ: Π°Π²ΡΠΎΡΠ΅ΡΠ΅ΡΠ°Ρ Π΄ΠΈΡΡΠ΅ΡΡΠ°ΡΠΈΠΈ Π½Π° ΡΠΎΠΈΡΠΊΠ°Π½ΠΈΠ΅ ΡΡΠ΅Π½ΠΎΠΉ ΡΡΠ΅ΠΏΠ΅Π½ΠΈ ΠΊΠ°Π½Π΄ΠΈΠ΄Π°ΡΠ° ΡΠ΅Ρ Π½ΠΈΡΠ΅ΡΠΊΠΈΡ Π½Π°ΡΠΊ
Dry etching and micromachining with laser radiation of short wavelength and pulse length are investigated to present their process capabilities for the production of surface structures within precision Silicon components. The laser dry etching processing (CCl4) with Excimer laser radiation (lambda L=248 nm, tauta L=20 ns) is modified by using a microwave-excited processing gas (CF4). Furthermore, methylmethacrylate is additionally used to study the influence of polymerisation on the etched structures. The micromachining with frequency-doubled Nd:YLF laser radiation (lambda L=527 nm, tauta L=30 ps) is performed yielding more precise structures during drilling and caving due to the lower heat and pressure load during the interaction time. The processes involved in dry etching and micromachining with laser radiation are studied by high-speed photography, mass spectroscopy and optical spectroscopy, whereas the produced structures are analyzed by profilometry, optical and electron microscop y as well as electron spectroscopy such as XPS and AES. The results are discussed in view of applications for surface patterning of precision Silicon components