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10 research outputs found

Another dimension in integrated circuit trust

Author: A Rahman
JU Knickerbocker
K Xiao
PS Andry
S Adee
S Bhunia
S Pope
ST King
V Pavlidis
WR Davis
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

The Development of Unisys Multichip Modules

Author: AJ Blodgett
AS Rappaport
B Blood
E Davidson
HW Markstein
J Nelson
JU Knickerbocker
KO Brien
RD Rhodes
VL Gani
“Emerging Technologies
“Should the U.S
“The MCM Market
Publication venue: 'Springer Science and Business Media LLC'
Publication date: 01/01/1993
Field of study

A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications

Author: C Jang
CK Chung
CK Chung
CT Peng
JU Knickerbocker
K Takahashi
KL Suk
Kyung-Wook Paik
MJ Yim
MJ Yim
MJ Yim
Sang-Hoon Lee
SH Lee
SH Lee
WS Kwon
YW Chiu
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient

Author: C Herring
CM Liu
CM Liu
CS Tan
F Fournel
G Gottstein
H Takagi
H-Y Hsiao
JU Knickerbocker
P Gondcharton
QY Tong
R Niu
R Tadepalli
RL Coble
RL Fullman
SY Hsu
T LaGrange
T Suga
T-C Liu
Y Huang
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Package Electrical Testing

Author: A Gopinath
A Hopper
A Landzberg
AJ Blodgett
B Davis
CM Maunder
DA Doane
F Jensen
Georgia Institute of Technology
JH Lau
JR Brews
JU Knickerbocker
KW Goossen
M Brunner
M Brunner
M Sriram
N Nagi
P Slade
PB Katehi
RR Tummala
RW Jackson
S Yao
S. DeFoster
SD Golladay
T Knowles
TS Chu
W Menzel
WH Kautz
X Zhang
Y Zorian
Publication venue: 'Springer Science and Business Media LLC'
Publication date: 01/01/1997
Field of study

Ultrafast-laser dicing of thin silicon wafers: strategies to improve front- and backside breaking strength

Author: A Ostendorf
B Majeed
Bernadette Egle
BN Chichkov
C Fornaroli
C Fornaroli
DA Porter
DS Finn
DYR Chong
Elisabeth Schwarz
Gernot Fasching
HK Tönshoff
JH Lau
JM Liu
JU Knickerbocker
M Domke
M Domke
M Domke
M Domke
M Kumagai
MA Green
Marius Bodea
Matthias Domke
N Bärsch
N Sudani
O Haupt
PC Verburg
S Schoenfelder
S-H Chae
Sandra Stroj
Tan Zhang
THR Crawford
Y-H Zhang
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Ceramic Packaging

Author: AJ Blodgett
AJ Blodgett
AJ Rothman
B Schwartz
CJ Bartlett
EA Giess
EA Giess
EM Davis
FM Fowkes
GA Slack
GM Adema
H Reiner
H Stetson
HE Exner
JC Williams
JH Jean
JH Jean
JK Yamamoto
JN Humenik
JR Piazza
JRH Black
JU Knickerbocker
JW Balde
K Komeya
K Watanabe
K. Watanabe
LE Cross
LE Dolhert
LE Gross
M Marmo
M Terasawa
N Kuramoto
N Kuramoto
N Miyashiro
P Silva
PE Fox
PE Garrou
PJ Holmes
PW McMillan
R Chanchani
RA Gardner
RE Mistier
RG Frieser
RHF Lloyd
RN Master
RR Tummala
RR Tummala
RR Tummala
S Hamano
TB Reed
TC Patton
VA Lavrenko
WA Yarbrough
WD Kingery
WS Young
Y Shimada
Y Shimade
Publication venue: 'Springer Science and Business Media LLC'
Publication date: 01/01/1997
Field of study

Thermal Management of Flip Chip Packages

Author: A Bar-Cohen
AD Kraus
AE Bergles
B Cola
B Dang
B Smith
B Yang
CJM Lasance
DA Johnson
DL Cochran
DP Kennedy
FP Incropera
GF Goth
J Torresola
JG Torok
JP Holman
JR Culham
JS Kolodzey
JU Knickerbocker
JW Peeples
JW Sofia
K Azar
K Pashayi
K Sakuma
L Michalski
L-T Yeh
M Iyengar
MF Modest
MP Gupta
PG Emma
PRN Childs
R Mahalingam
RC Chu
RD Danielson
RE Simons
RE Simons
RE Simons
RE Simons
RJ Armstrong
RR Schmidt
S Godfrey
S Ramanathan
SJ Koester
SM Sri-Jayantha
SV Patankar
T Acikalin
TS Fischer
V Kadambi
W Rhett
WJ Mincowycz
YS Muzychka
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Sensorische Integration bei Risikokindern und Kleinkindern

Author: A Montague
AJ Ayres
AJ Ayres
AJ Ayres
AJ Ayres
Au Thomas
B Chandler
BE Hanft
BM Knickerbocker
BM Lester
Bu Hanft
Bu Provost
CJ Dunst
Cu Lombroso
DN Stern
Du Jirgal
E Holloway
E Mullen
EM Mullen
G DeGangi
GAu DeGangi
GGu Williamson
H Als
H Als
H Als
H Als
HD Dunning
IE Asher
J Bowlby
J Case-Smith
J Holroyd
J LaCroix
JA Koomar
JAu Koomar
JP Burke
JPu Burke
Ju Burke
LJ Miller
LJ Miller
LJ Miller
LS Vygotsky
Lu King-Thomas
MDS Ainsworth
ME Anzalone
MIu Posner
MSu Williams
N Bayley
N Bayley
P Wilbarger
PA Gorski
Pu Wilbarger
R Abibin
R Darling
RAu Berk
RC Schaaf
RCu Schaaf
RCu Schaaf
RCu Schaaf
RCu Schaaf
REKu Stein
RHu Moos
Ru Bradley
S Greenspan
S Stallings-Sahler
S Zeitlin
SB Anderson
SI z Greenspan
SIu Greenspan
Su Zeitlin
SW Porges
SW Porges
TB Brazelton
TB Brazelton
TM Field
Tu Berge
TW Lindner
W Dunn
W Dunn
WJ Coster
WKu Berg
Wu Dunn
Publication venue: 'Springer Science and Business Media LLC'
Publication date: 01/01/2004
Field of study

Flip-Chip Interconnections: Past, Present, and Future

Author: B Dang
BF Dyson
BF Dyson
C Chen
D Mallik
D-Y Shih
DC Yeh
DQ Yu
DR Frear
DW Henderson
FH Huang
G Dietz
G Ghosh
GY Li
HT Lee
I Hazeyama
IA Blech
IE Anderson
J Guo
J-W Nah
JA Rayne
JD Barnett
JD Meindl
JH Lau
JL Everhart
JU Knickerbocker
JW Jang
JW Nah
K Zeng
K-W Moon
KN Tu
KS Kim
L Schaper
L Xu
LF Miller
M Lu
M Lu
M Lu
MG Cho
MG Cho
MJ Rizvi
MJ Sullivan
P Gruber
PA Totta
R Chanchani
R Kinyanjui
S Terashima
S-K Seo
SK Kang
SK Kang
SK Kang
SK Kang
SK Kang
SK Kang
SK Kang
SK Kang
SK Seo
SY Jang
T Laurila
WK Choi
WP Mason
WT Chen
Y Kariya
YC Sohn
YC Sohn
YK Jee
YS Lai
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

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