1 research outputs found
Thermal Management of Flip Chip Packages
- Author
- A Bar-Cohen
- AD Kraus
- AE Bergles
- B Cola
- B Dang
- B Smith
- B Yang
- CJM Lasance
- DA Johnson
- DL Cochran
- DP Kennedy
- FP Incropera
- GF Goth
- J Torresola
- JG Torok
- JP Holman
- JR Culham
- JS Kolodzey
- JU Knickerbocker
- JW Peeples
- JW Sofia
- K Azar
- K Pashayi
- K Sakuma
- L Michalski
- L-T Yeh
- M Iyengar
- MF Modest
- MP Gupta
- PG Emma
- PRN Childs
- R Mahalingam
- RC Chu
- RD Danielson
- RE Simons
- RE Simons
- RE Simons
- RE Simons
- RJ Armstrong
- RR Schmidt
- S Godfrey
- S Ramanathan
- SJ Koester
- SM Sri-Jayantha
- SV Patankar
- T Acikalin
- TS Fischer
- V Kadambi
- W Rhett
- WJ Mincowycz
- YS Muzychka
- Publication venue
- 'Springer Science and Business Media LLC'
- Publication date
- Field of study