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3 research outputs found
Evaluation of Lead- Free Solder Joints in Electronic Assemblies
Author
A. M. Jackson
B. Masson
+16 more
C.A. MacKay
G. Humpston
H.D. Solomon
I. Artaki
J. London
J. London
J. Marshall
J.R. Getten
K.R. Stone
L. Morrison
M. Harada
P. T. Vianco
P. Vianco
P. Vianco
S. Smernos
Z. Mei
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
Author
C. Lea
C. Melton
+28 more
C.A. MacKay
D.M. Jarboe
E.W. Hare
G. Humpston
J. London
J. Seyyedi
J.H. Vincent
J.L. Freer
J.L. Freer Goldstein
J.L. Marshall
J.R. Getten
J.S. Hwang
J.W. Morris
J.W. Morris
Judith Glazer
L. Quan
L.E. Felton
M. Warwick
M.E. Warwick
P.G. Harris
R. Satoh
R. Strauss
R.W. Wild
S. Pattanaik
W.J. Tomlinson
Z. Guo
Z. Mei
Z. Mei
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Lead (Pb)-free solders for electronic packaging
Author
Amit K. Sarkhel
B. Predel
+29 more
B. Roos-Kozel
C. Mackay
D. Tribula
F. Ojebuoboh
H. Rack
J. Fischer
J. Seyyedi
J.R. Getten
J.S. Corbin
J.T. Yeh
K.J. Puttlitz
L. Rice
L. Wilson
M. Harada
M. McCormack
M.D. Ries
O. Chirino
R. Herdzik
R.T. Howard
S. Pattanaik
S.K. Kang
Sung K. Kang
T. Lombardi
T. Ogashiwa
W. Allen
W. Tomlinson
W.A. Baker
Z. Mei
Z. Mei
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref