2 research outputs found
Thermal Interface Materials
- Author
- A. Iwabuchi
- A. Sepehr
- C-P. Chiu
- C.-P. Chiu
- C.-P. Chiu
- C.-P. Chiu
- C.-W. Nan
- C.H. Liu
- C.V. Madhusudana
- E.T. Thostenson
- G.L. Solbrekken
- J. Hone
- J. Torresola
- L.S. Pritchard
- M.A. Lambert
- M.J. Biercuk
- M.M. Yovanovich
- P. Kim
- R. Aoki
- R. Mahajan
- R. Prasher
- R. Prasher
- R.S. Prasher
- R.S. Prasher
- R.S. Prasher
- R.S. Prasher
- R.S. Prasher
- R.S. Prasher
- S. Huxtable
- S.A. Putnam
- T.J. Goh
- T.L. Tansley
- X. Hu
- Publication venue
- 'Springer Science and Business Media LLC'
- Publication date
- 01/01/2009
- Field of study
Thermal Management of Flip Chip Packages
- Author
- A Bar-Cohen
- AD Kraus
- AE Bergles
- B Cola
- B Dang
- B Smith
- B Yang
- CJM Lasance
- DA Johnson
- DL Cochran
- DP Kennedy
- FP Incropera
- GF Goth
- J Torresola
- JG Torok
- JP Holman
- JR Culham
- JS Kolodzey
- JU Knickerbocker
- JW Peeples
- JW Sofia
- K Azar
- K Pashayi
- K Sakuma
- L Michalski
- L-T Yeh
- M Iyengar
- MF Modest
- MP Gupta
- PG Emma
- PRN Childs
- R Mahalingam
- RC Chu
- RD Danielson
- RE Simons
- RE Simons
- RE Simons
- RE Simons
- RJ Armstrong
- RR Schmidt
- S Godfrey
- S Ramanathan
- SJ Koester
- SM Sri-Jayantha
- SV Patankar
- T Acikalin
- TS Fischer
- V Kadambi
- W Rhett
- WJ Mincowycz
- YS Muzychka
- Publication venue
- 'Springer Science and Business Media LLC'
- Publication date
- Field of study