3 research outputs found
Reliability of a flip-chip package thermally loaded between −55°C and 125°C
- Author
- Publication venue
- 'Springer Science and Business Media LLC'
- Publication date
- Field of study
Correlation of stress and optical properties in highly transparent polyimides for future flexible display
- Author
- Publication venue
- 'Springer Science and Business Media LLC'
- Publication date
- Field of study
Wafer Bumping
- Author
- A Drift
- A Miyajima
- A Ostmann
- A Zribi
- AA Liu
- B Rosner
- BS Berry
- BT Clark
- CJ Speerschneider
- CW Argento
- CY Liu
- D Brownell
- D Hayes
- DB Bogy
- DB Wallace
- DB Wallace
- DJ Hayes
- DJ Levy
- E Barson
- E Kasulke
- EK Yung
- EM Davis
- F Stepniak
- Fatigue-Resistant Lead-Free Alloy U.S
- G Adema
- G Azdasht
- G Diez
- GM Adema
- H Atarashi
- H Dalal
- H Dalal
- H Han
- H Matsubara
- H Otsuki
- HA Nye
- Hitachi Chemical
- I Watanabe
- J Kivilahti
- J Langdon
- J Liu
- J Liu
- J Salonen
- JB Nysæther
- JE Dijksman
- JH Lau
- JM Waldvogel
- JS Aden
- K Endoh
- K Hatada
- K Hatada
- K Hatada
- K Hatada
- K Haven De
- K Persson
- K Sakuma
- L Fanti
- LE Miller
- LF Miller
- LLS Wiegele
- M Datta
- M Masuda
- M Varnau
- M Varnau
- M Vrana
- M Warrior
- MF Dautartas
- MJ Sheaffer
- N Cherukuri
- N Nuzaki
- N Veen van
- N Yasuo
- NV Mandich
- P Elenius
- PA Totta
- PV Robock
- R Aschenbrenner
- R Estes
- R Richter
- R Shukla
- RC Early
- RP Sopher
- S Bhattacharya
- S Mannan
- SE Greer
- SE Greer
- SIA Roadmap
- T Kamei
- T Kawanobe
- T Kawanobe
- T Nukii
- T Oppert
- US Casio
- US Casio
- US Casio
- US Sharp
- V Pennanen
- W Riedel
- W Stijns
- W Takahashi
- W Takahashi
- X. Wang
- Y Bessho
- Y Bessho
- Y Fu
- Y Taguma
- Y Tsukada
- Z Lai
- Z Mei
- Z Mei
- Publication venue
- 'Springer Science and Business Media LLC'
- Publication date
- 01/01/2001
- Field of study