EXPLOITATION OF LTCC QUALITIES IN GAS SENSORS APPLICATION

In this contribution we deal with technology potential of the low temperature co-fired ceramic (LTCC) in association with design, development and production of organometallic thick film gas sensors. Customer demands to the gas sensors array and to the joint construction of the sensing part with evaluating ASIC led to the exploitation of LTCC potential in the production technology. The presented outcomes are based on the lot of investigations and simulations on the several models of organometallic gas sensors made with one common factor- low temperature co-fired ceramic utilisation The most important characteristic of LTCC and main reason for its utilisation in technology of sensor production is behind its temperature charactersistics also the possibility to fabricate various shapes in several separate layers which finally create monolithic ceramic module based on its attractive features. In this review, we want to emphasise tailored utilisation of LTCC in thick film based gas sensors, which were successively realised in the following parts: LTCC based multilayer heating systems for achievement of sensor operating temperature with exceedingly flat temperature distribution in the active sensor area, creation of the special LTCC sensor/ASIC carrier for relative high temperature and safety operation and finally LTCC based design for the gas sensor array

ANISOTROPIC CONDUCTIVE JOINTS UTILIZATION FOR JOINING OF FLEXIBLE CABLES AT RIGID SUBSTRATES

Key motivation of this work is the industrial task of standard lead based solders joints elimination in electronics, which comes out from the European Council requirement to exclude lead from the soldering process before the middle of 2006. The main emphasis was laid on the new approaches in tasks solving by using standard electrotechnologies and available production facilities. Results of this work were based on two types of anisotropic interconnections usability as an alternative of soldered joints in the production process, which is generally used for a reflow of the standard SnPb solder between the contact areas. Practical results of the performed study indicate that realized joints with applied anisotropic conductive adhesive have comparable electrical resistance with soldered interconnections. The lower mechanical strength is less relevant with concerning of operating conditions. The anisotropic conductive paste application demonstrates their suitability for copper-to-gold plated contacts conductive joining; however, adhesive joints realized by an anisotropic conductive tape were not satisfactory