Turbulence compensation: an overview

In general, long range visual detection, recognition and identification are hampered by turbulence caused by atmospheric conditions. Much research has been devoted to the field of turbulence compensation. One of the main advantages of turbulence compensation is that it enables visual identification over larger distances. In many (military) scenarios this is of crucial importance. In this paper we give an overview of several software and hardware approaches to compensate for the visual artifacts caused by turbulence. These approaches are very diverse and range from the use of dedicated hardware, such as adaptive optics, to the use of software methods, such as deconvolution and lucky imaging. For each approach the pros and cons are given and it is indicated for which scenario this approach is useful. In more detail we describe the turbulence compensation methods TNO has developed in the last years and place them in the context of the different turbulence compensation approaches and TNO’s turbulence compensation roadmap. Furthermore we look forward and indicate the upcoming challenges in the field of turbulence compensation

A new package for silicon biosensors

A new concept is presented for packaging of silicon biosensor chips in disposable cartridges for medical diagnostic applications. Manufacturing of these devices requires connection and packaging techniques for fluidic, mechanical and electrical functions. The presented packaging concept consists of a Molded Interconnection Device (MID), a mm2-sized silicon biosensor chip, a flexfoil, and a fluidic part. The device shows reliable electrical interconnection between sensor chip and readout electronics. Also the fluidic pathway is proved to be reliable during operation. The packaging concept allows easy further integration of electrical and mechanical functions

A new package for silicon biosensors

A new concept is presented for packaging of silicon biosensor chips in disposable cartridges for medical diagnostic applications. Manufacturing of these devices requires connection and packaging techniques for fluidic, mechanical and electrical functions. The presented packaging concept consists of a Molded Interconnection Device (MID), a mm2-sized silicon biosensor chip, a flexfoil, and a fluidic part. The device shows reliable electrical interconnection between sensor chip and readout electronics. Also the fluidic pathway is proved to be reliable during operation. The packaging concept allows easy further integration of electrical and mechanical functions

Packaging of silicon sensors for microfluidic bio-analytical applications

A new industrial concept is presented for packaging biosensor chips in disposable microfluidic cartridges to enable medical diagnostic applications. The inorganic electronic substrates, such as silicon or glass, are integrated in a polymer package which provides the electrical and fluidic interconnections to the world and provides mechanical strength and protection for out-of-lab use. The demonstrated prototype consists of a molded interconnection device (MID), a silicon-based giant magneto-resistive (GMR) biosensor chip, a flex and a polymer fluidic part with integrated tubing. The various processes are compatible with mass manufacturing and run at a high yield. The devices show a reliable electrical interconnection between the sensor chip and readout electronics during extended wet operation. Sandwich immunoassays were carried out in the cartridges with surface functionalized sensor chips. Biological response curves were determined for different concentrations of parathyroid hormone (PTH) on the packaged biosensor, which demonstrates the functionality and biocompatibility of the devices. The new packaging concept provides a platform for easy further integration of electrical and fluidic functions, as for instance required for integrated molecular diagnostic devices in cost-effective mass manufacturing

Packaging of silicon sensors for microfluidic bio-analytical applications

A new industrial concept is presented for packaging biosensor chips in disposable microfluidic cartridges to enable medical diagnostic applications. The inorganic electronic substrates, such as silicon or glass, are integrated in a polymer package which provides the electrical and fluidic interconnections to the world and provides mechanical strength and protection for out-of-lab use. The demonstrated prototype consists of a molded interconnection device (MID), a silicon-based giant magneto-resistive (GMR) biosensor chip, a flex and a polymer fluidic part with integrated tubing. The various processes are compatible with mass manufacturing and run at a high yield. The devices show a reliable electrical interconnection between the sensor chip and readout electronics during extended wet operation. Sandwich immunoassays were carried out in the cartridges with surface functionalized sensor chips. Biological response curves were determined for different concentrations of parathyroid hormone (PTH) on the packaged biosensor, which demonstrates the functionality and biocompatibility of the devices. The new packaging concept provides a platform for easy further integration of electrical and fluidic functions, as for instance required for integrated molecular diagnostic devices in cost-effective mass manufacturing