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1 research outputs found
Chip-Scale Packaging and Its Failure Analysis Challenges
Author
Garcia
Intel 2000 Package Databook
+7 more
ISTFA 2017 Technical Program
ISTFA 2017 Technical Program
ISTFA 2018 Tutorial
Lau
Maxim Integrated Application Note AN4002
NXP Application Note
Tang
Publication venue
'ASM International'
Publication date
01/01/2019
Field of study
No full text
Crossref
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