АММИАЧНАЯ МОЛЕКУЛЯРНО-ПУЧКОВАЯ ЭПИТАКСИЯ ГЕТЕРОСТРУКТУР AlGaN НА ПОДЛОЖКАХ САПФИРА

In order to develop a technology for the growth of Al(Ga)N-based heterostructures, the effect of different molecular beam epitaxy growth conditions on the properties of AlN and AlGaN layers was studied. The optimal conditions for the growth of AlN buffer layers were established, which made it possible to achieve a root mean square roughness as small as 0.7 nm. It was shown that an increase of AlN layer thickness leads to a decrease of density of edge dislocations, while no explicit dependence of the screw dislocation densityon the layer thickness was observed. The minimal obtained dislocations density values for 1.25μm-thick AlN layer were nedges = 5.9×109 cm-2 and nscrew = 2.2×107 cm-2 for edge and screw dislocations respectively. As a result of optimization of the AlGaN growth temperature, a series of 0.15μm-thick layers was grown, which showed stimulated emission at wavelengths λ = 330 nm, 323 nm, 303 nm, and 297 nm with threshold powerdensities of 0.7 MW/cm2, 1.1 MW/cm2, 1.4 MW/cm2 and 1.4 MW/cm2, respectively. The determined optimal epitaxy conditions for AlN and AlGaN layers were used to grow the AlGaN/GaN high electron mobility transistor structure on a sapphire substrate with two-dimensional electron gas, which had a mobility of 1950 cm2/(Vs) at a concentration of 1.15×1013 cm-2. The obtained results are important for creating of nitride-basedUV-emitting optoelectronic semiconductor devices, as well as high-power and high-frequency electronic devices.В работе с целью разработки технологии роста гетероструктур на основе Al(Ga)Nисследовалось влияние различных условий роста гетероструктур молекулярно-пучковой эпитаксией на свойства слоев AlN и AlGaN. Были установлены условия для роста буферных слоев AlN, которые позволили достигнуть среднеквадратичного значения величины шероховатостей 0,7 нм. Показано, что увеличение толщины слоя AlN приводит к уменьшению плотности краевых дислокаций, в то время как явной зависимости плотности винтовых дислокаций от толщины слоя не наблюдалось. Минимальные полученные значения плотности проникающих дислокаций для слоя AlN толщиной 1,25 мкм составили nкраев. = 5,9×109 см-2 и nвинт. = 2,2×107 см-2. В результате оптимизации температуры роста AlGaN была выращена серия слоев толщиной 0,15 мкм, показавших стимулированное излучение на длинах волн λ = 330 нм, 323 нм, 303 нм и 297 нм с пороговыми плотностями мощности 0,7 МВт/см2, 1,1 МВт/см2, 1,4 МВт/см2 и 1,4 МВт/см2 соответственно. Установленные условия эпитаксии слоев AlN и AlGaN на подложках сапфира были использованы для роста транзисторной структуры AlGaN/GaN на подложке сапфира с двумерным электронным газом, который имел подвижность 1950 см2/(Вс) при концентрации 1,15×1013 см-2. Полученные результаты важны для создания излучающих оптоэлектронных полупроводниковых приборов, работающих в УФ области спектра, а также приборов силовой и высокочастотной электроники на основе нитридов

AMMONIA MOLECULAR BEAM EPITAXY OF AlGaN HETEROSTRUCTURES ON SAPPHIRE SUBSTRATES

In order to develop a technology for the growth of Al(Ga)N-based heterostructures, the effect of different molecular beam epitaxy growth conditions on the properties of AlN and AlGaN layers was studied. The optimal conditions for the growth of AlN buffer layers were established, which made it possible to achieve a root mean square roughness as small as 0.7 nm. It was shown that an increase of AlN layer thickness leads to a decrease of density of edge dislocations, while no explicit dependence of the screw dislocation densityon the layer thickness was observed. The minimal obtained dislocations density values for 1.25μm-thick AlN layer were nedges = 5.9×109 cm-2 and nscrew = 2.2×107 cm-2 for edge and screw dislocations respectively. As a result of optimization of the AlGaN growth temperature, a series of 0.15μm-thick layers was grown, which showed stimulated emission at wavelengths λ = 330 nm, 323 nm, 303 nm, and 297 nm with threshold powerdensities of 0.7 MW/cm2, 1.1 MW/cm2, 1.4 MW/cm2 and 1.4 MW/cm2, respectively. The determined optimal epitaxy conditions for AlN and AlGaN layers were used to grow the AlGaN/GaN high electron mobility transistor structure on a sapphire substrate with two-dimensional electron gas, which had a mobility of 1950 cm2/(Vs) at a concentration of 1.15×1013 cm-2. The obtained results are important for creating of nitride-basedUV-emitting optoelectronic semiconductor devices, as well as high-power and high-frequency electronic devices