RF-MEMS packaging by using quartz caps and epoxy polymers

This work reports on RF MEMS chip capping to protect sensitive devices by quartz caps having a cavity to enclose MEMS devices and an epoxy film polymer as a sealing ring. Full hermeticity is not possible due to the permeability of polymer but the goal to protect the mobile parts of the devices during dicing and assembling was achieved. Good RF MEMS devices are produced by die-to-die bonding and a reliable fabrication process is defined while wafer-to-wafer process still needs improvement to increase the fabrication yield. In this paper the fabrication process for both die-to-die and wafer-to-wafer 0-level capping is presented. Good adhesion of caps to the substrate is demonstrated by shear tests, while RF measurements on CPW lines indicate a negligible insertion loss increase. Capping of both capacitive and ohmic contact switches is reported showing no loss of functionality but a modification of actuation voltage induced by thermal treatment

RF MEMS continuous reversible variable inductor based on a microfluidic network

International audienceIn this work, RF MEMS continuous reversible variable inductor has been fabricated by using microelec-tronic technology and lamination process. We review, evaluate and compare this variable inductor with other work. The proposed inductor is a dual circular coil and has an inductance of few nH. The fundamental idea is to place a liquid droplet between the metal turns of a coil in order to modify the capacitive/resistive coupling between metal tracks and hence to change the stored magnetic energy. The SU-8 resin was used to realize the microfluidic channels and Au as metallic tracks. To prove the reversibility of the inductor, two cases were studied: filling and emptying of channels. The tuning range of the inductance is approximately 107 % at 1.6 GHz, making these devices very suitable as building blocks in many RF applications