Electrical and Mechanical Properties of Plated Ni/Cu Contacts for Si Solar Cells

AbstractPlated Ni/Cu/Ag contacts are an industrially feasible metallization approach for high efficiency c-Si solar cells with low surface doping concentrations (1018 cm-3 < ND < 1020 cm-3). The 2d-simulations of this work define the minimum requirements on the contact resistivity of metal contacts in a high efficiency solar cell design. The following experimental study of the contact resistivity of plated Ni/Cu/Ag contacts on lowly doped phosphorus emitter demonstrates low contact resistivities in the mΩcm2 regime, which enable solar cells with high fill factors. Furthermore, the paper analyzes the influence of the thermal silicidation process on pseudo-fill factor losses and on the mechanical contact adhesion. The contact adhesion is also studied with respect to the laser contact opening process. The results of this work demonstrate that the right choice of back-end processes enable plated Ni/Cu/Ag contacts with low contact resistivities in combination with high contact adhesions above 1 N/mm

Micro Characterization and Imaging of Spikes in Nickel Plated Solar Cells

AbstractAnnealing induced silicidation of plated nickel contacts can severly lower the solar cell performance due to deep nickel silicide spikes penetrating the space charge region. This work summarizes several attempts to characterize performance limiting deep silicide structures and determines the influence of different passivation layer structuring technologies on the silicide growth. Reverse biased electroluminescence measurements revealed that the deep nickel silicides occur after an anneal and arelocated along the structured and plated passivation layer openings. Cross-section studies of the plated contacts demonstrated that deep silicide growth is present independently of the applied passivation layer structuring technology. While for laser-ablation the critical silicide structures could be mostly attributed to accelerated silicide growth at laser induced defects, there are also deep silicide structures that appear without any obvious correlation even in the case of defect free wet chemical passivation structuring of the contact openings. By varying the emitter doping profile and the annealing temperature after plating the distance of the space charge region and the surface was found to influence the annealing-induced solar cell performance decrease. Considering the presented results there are three ways to overcome annealing induced degradation of Ni plated solar cells. Either optimized process designs with sufficient contact adhesion and contact resistivity without the need of thermal silicide formation, improved silicide depth control (e.g. Ni source limited growth) or the implementation of a selective emitter design with pn-junction depths well above 1 μm within the contacted area