Evaluation of Addition of Reactive Resin for an Adhesive Formulation of Pressure-Sensitive Adhesive

Nowadays, adhesive industry is growing, and its development will be important in a short future because it offers good returns, and in some cases it is a better option for packaging and sealing with advantages in prices, productivity and weight reduction. In terms of joining and/or sealing, adhesives are well positioned among joining systems; however, knowledge about adhesives is need for their efficient use and only through proper design of the union can be achieved satisfactory results. In this chapter, a development of a formulation of pressure-sensitive adhesive based on styrene-butadiene copolymers using a reactive resin is reported. Non-aromatic solvents were used in adhesive formulation with the aim of avoiding the emission of harmful solvents into the Atmosphere, and the adequate combination and amount of solvents were found. The effect of addition of a phenolic resin in the adhesive formulation as a crosslinking agent was evaluated. By means Fourier Transform Infrared spectroscopy (FTIR), the crosslinking reaction was also studied. The performance of adhesive formulation was evaluated by means of dynamic mechanical analysis (DMA)