The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.Comment: 82 pages, 66 figure

Monitoring Quality of ATLAS ITk Strip Sensors/wafers through Database

High-Luminosity LHC upgrade necessitated a complete replacement of the ATLAS Inner Detector with a larger all-silicon tracker. The strip portion of it covers 165 m2 area, afforded by the strip sensors. Following several prototype iterations and a successful pre-production, a full-scale production started in 2021, to finish by the beginning of 2025. It will include over 20,000 wafers and a factor of 5 higher throughput than pre-production, with about 500 sensors produced and tested per month. The transition to production stressed the need to evaluate the results from the Quality Control (QC) and Quality Assurance (QA) tests quickly to meet the monthly delivery schedule. The test data come from 15 collaborating institutes, therefore a highly distributed system with standardized interfaces was required. Specialized software layers of QA and QC Python code were developed against the backend of ITkdatabase (DB) for this purpose. The developments included particularities and special needs of the Strip Sensors community, such as the large variety of different test devices and test types, the necessary test formats, and different workflows at the test sites. Special attention was paid to techniques facilitating the development and user operations, for example creation of “parallel” set of dummy DB objects for practice purpose, iterative verification of operability, and the automatic upload of test data. The scalability concerns, and automation of the data handling were included in the system architecture from the very inception. The full suite of functionalities include data integrity checks, data processing to extract and evaluate key parameters, cross-test comparisons, and summary reporting for continuous monitoring. We will also describe the lessons learned and the necessary evolution of the system

Monitoring Quality of ATLAS ITk Strip Sensors through Database

The high-Luminosity LHC upgrade necessitates a complete replacement of the ATLAS Inner Detector with a larger all-silicon tracker. The strip portion of it covers 165 m$^2$ area, afforded by the strip sensors. Following several prototype iterations and a successful pre-production, a full-scale production started in 2021, to finish in 2025. It will include about 21,000 wafers and a factor of 5 higher throughput than pre-production, with about 500 sensors produced and tested per month. The transition to production stressed the need to evaluate the results from the Quality Control (QC) and Quality Assurance (QA) tests quickly to meet the monthly delivery schedule. The test data come from 15 collaborating institutes, therefore a highly distributed system with standardized interfaces was required. Specialized software layers of QA and QC Python code were developed against the backend of the ITk database (DB) for this purpose. The developments included particularities and special needs of the Strip Sensors community, such as the large variety of different test devices and test types, the necessary test formats, and different workflows at the test sites. Special attention was paid to techniques facilitating the development and user operations, for example creation of “parallel” sets of dummy DB objects for practice purposes, iterative verification of operability, and the automatic upload of test data. The scalability concerns and automation of the data handling were included in the system architecture from the very inception. The full suite of functionalities include data integrity checks, data processing to extract and evaluate key parameters, cross-test comparisons, and summary reporting for continuous monitoring. We will also describe the lessons learned and the necessary evolution of the system

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests