The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector, its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100 % silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-25) and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.Comment: 82 pages, 66 figure

Real time tracker based upon local hit correlation circuit for silicon strip sensors

For the planned high luminosity upgrade of the Large Hadron Collider (LHC), a significant performance improvement of the detectors is required, including new tracker and trigger systems that makes use of charged track information early on. In this note we explore the principle of real time track reconstruction integrated in the readout electronics. A prototype was built using the silicon strip sensor for the ATLAS phase-II upgrade. The real time tracker is not the baseline for ATLAS but is nevertheless of interest, as the upgraded trigger design has not yet been finalized. For this, a new readout scheme in parallel with conventional readout, called the Fast Cluster Finder (FCF), was included in the latest prototype of the ATLAS strip detector readout chip (ABC130). The FCF is capable of finding hits within 6 ns and transmitting the found hit information synchronously every 25 ns. Using the FCF together with external correlation logic makes it possible to look for pairs of hits consistent with tracks from the interaction point above a transverse momentum threshold. A correlator logic finds correlations between two closely spaced parallel sensors, a “doublet”, and can generate information used as input to a lowest level trigger decision. Such a correlator logic was developed as part of a demonstrator and was successfully tested in an electron beam. The results of this test beam experiment proved the concept of the real time track vector processor with FCF

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests