Effects of curcumin and luteolin on viability and cell death induction in NFS-60 cell line

Inducing cell death in tumor cells has been recognized as a promising strategy in curing tumors. Parallely, natural products, especially those with long-known usage in folk medicine, are gaining demanding and extensive clinical interests. Aiming to contribute to overall knowledge of curcumin and luteolin antitumour potentials, we analyzed their effects on cell death induction in NFS-60 cell line, using Trypan blue exclusion assay and TransDetect® Anenexin V-EGFP/PI assay. Results show that both tested agents induce cell death, especially in higher applied concentrations, but further investigations are needed to elucidate the mechanisms behind it

Test of High-Resolution Muon Drift-Tube Chambers for the Upgrade of the ATLAS Experiment

High-resolution muon drift-tube chambers were studied as a part of the planned upgrades of the ATLAS detector for the high luminosity (HL) LHC. To suppress fake muon triggers, observed in the transition region from the barrel to the endcaps of the ATLAS muon spectrometer, 16 new so-called "BIS-78" sMDT chambers will be installed in this region. As a part of this thesis, functionality tests of the eight A-side sMDT chambers are performed prior to their installation in the ATLAS detector, during the 2019/20 shutdown of the LHC. All chambers are tested in a cosmic-ray test stand. The chamber performance is characterized by measuring the noise rates, spatial resolution and the muon detection efficiency of each drift tube in the chamber. The second part of this thesis is dedicated to determination of the operational point of the amplifier-shaper-discriminator (ASD) chips for the new read-out electronics, which was developed for the operation at the HL-LHC. The noise rates, spatial resolution and muon detection efficiency are determined with two read-out cards carrying new ASD chips

ATLAS ITk Pixel quad module test-beam measurements

For the HL-LHC upgrade, the current tracking system of the ATLAS experiment will be replaced by an all-silicon system, called the Inner Tracker (ITk), consisting of an inner Pixel Detector and an outer Strip Detector. The ITk Pixel Detector has two types of modules foreseen: triplet modules with 3D sensors in the innermost layer, and quad modules with planar sensors in the other layers. In 2021, for the first time the properties of quad modules were measured in test-beams. The data reconstruction and analysis was optimised to properly account for the non-uniform pixel matrix of the sensors. This talk presents the ATLAS ITk Pixel Detector test-beam data analysis together with the properties of the quad modules, concentrating on the hit efficiency and the spatial resolution

Test of ITk 3D sensor pre-production modules with ITkPixv1.1 chip

ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25x100 µm2 (barrel) or 50x50 µm2 (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50x50 µm2) produced by FBK have been bump bonded to ITkPixv1.1 chip at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and at test beam

Qualification of the first preproduction 3D FBK sensors with ITkPixV1\

The ITk detector, the new ATLAS silicon tracking system for High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be 25x100 μm² in the barrel and 50x50 μm² in the end-caps, with one read-out electrode at the centre of each pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50x50 μm²) produced by FBK have been bump bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and at test beams. Few of these modules have been irradiated in Bonn and at the CERN IRRAD facility. Preliminary results of their characterization after irradiation will be shown, including measurements performed during SPS test beam campaigns in Summer 2022

Qualification of the first pre-production 3D FBK sensors with ITkPixV1 readout chip

The ITk detector, the new ATLAS silicon tracking system for the High Luminosity LHC (HL-LHC), will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be 25×100 μm$^{2}$ in the barrel and 50×50 μm$^{2}$ in the end-caps, with one readout electrode at the centre of each pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50×50 μm$^{2}$) produced by FBK have been bump-bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards (SCCs) and characterized in laboratory measurements and in test beam campaigns. Some of these modules have been irradiated in Bonn and at the CERN IRRAD facility. Preliminary results of their characterization after irradiation are shown, including measurements performed during test beam campaigns at CERN SPS in Summer 2022

ATLAS ITk Pixel Pre-production Planar Sensor Characterisation for the HL-LHC Upgrade

In the ATLAS detector upgrade for the High-Luminosity LHC (HL-LHC), the current Inner Detector will be replaced with an all-silicon Inner Tracker (ITk), to operate under higher occupancy (instantaneous luminosity $7.5\times10^{34}\;\rm cm^{-2}s^{-1}$, which corresponds to about 200 inelastic pp collisions per bunch crossing) and radiation damage (particle fluence up to $2\times10^{16}\;\rm n_{eq}/cm^2$). The data taking is planned to start in 2029 and last for 10\,years. The innermost part of the ITk will be equipped with pixel modules, consisting of pixel sensors and novel ASICs, implemented in 65\,nm CMOS technology. The ITk project is currently in pre-production stage. To assure that specifications will be met during production, sensors and test structures from different vendors were sent to different sites for irradiation, hybridisation and follow-up testing. This paper presents the results of the characterisation of the pre-production planar sensor for ITk