Solidification of Al-Sn-Cu based immiscible alloys under intense shearing

The official published version of the Article can be accessed from the link below - Copyright @ 2009 The Minerals, Metals & Materials Society and ASM InternationalThe growing importance of Al-Sn based alloys as materials for engineering applications necessitates the development of uniform microstructures with improved performance. Guided by the recently thermodynamically assessed Al-Sn-Cu system, two model immiscible alloys, Al-45Sn-10Cu and Al-20Sn-10Cu, were selected to investigate the effects of intensive melt shearing provided by the novel melt conditioning by advanced shear technology (MCAST) unit on the uniform dispersion of the soft Sn phase in a hard Al matrix. Our experimental results have confirmed that intensive melt shearing is an effective way to achieve fine and uniform dispersion of the soft phase without macro-demixing, and that such dispersed microstructure can be further refined in alloys with precipitation of the primary Al phase prior to the demixing reaction. In addition, it was found that melt shearing at 200 rpm and 60 seconds will be adequate to produce fine and uniform dispersion of the Sn phase, and that higher shearing speed and prolonged shearing time can only achieve minor further refinement.This work is funded by the EPSRC and DT

Microstructural modification of Sn–Bi and Sn–Bi–Al immiscible alloys by shearing

Sn–20 wt-%Bi and immiscible Sn–20 wt-%Bi–1 wt-%Al alloys were used to understand the effect of high-intensity shearing on microstructural refinement. Novel ACME (Axial Centrifugal Metal Expeller) shearing device, based on axial compressor and rotor–stator mechanism to generate high shear rate and intense turbulence, was used to condition the melts prior to solidification. Microstructure in the Sn–Bi alloy deviated from dendritic grains with coarse eutectic pockets under conventional solidification to compact grains with well-dispersed eutectic under semisolid-state shearing. Decreasing the shearing temperature and increasing shearing time increased the globularity of grains. Following shearing, remnant liquid solidified into fine grain structure. In the immiscible Sn–Bi–Al alloy, shearing produced uniform dispersion of refined Al-rich particles in Sn-rich matrix as opposed to severe segregation under conventional solidification. The primary effect of shearing appears to originate from the thermo-solutal homogenisation of the melt and its effect on interface stability during solidification

Influence of Zn Concentration on Interfacial Intermetallics During Liquid and Solid State Reaction of Hypo and Hypereutectic Sn-Zn Solder Alloys

In this study, Sn-Zn solder samples containing 2 to 12 wt.% Zn were fabricated and reflowed into a Cu substrate. The microstructure of solder samples was observed after reflow and aging for up to 1000 h at 150°C. Thermodynamically stable intermetallics (IMCs) Cu-Zn and Cu-Sn formed at the interface depending on the solder composition. Formation of different interfacial IMCs during soldering and after prolonged aging is explained by the spalling mechanism that resulted from the depletion of Zn from the solder matrix

Effects of the adjustable ring-mode laser on intermetallic formation and mechanical properties of steel to aluminium laser welded lap joints

Research has confirmed a positive effect of laser beam shaping on controlling weld profiles and keyhole stabilisation, with significant reductions of porosity in weldments. However, few attempts with scattered results have studied the impact of laser beam shaping on intermetallic phase formation. This paper implements the adjustable-ring mode (ARM) laser and studies the impact of the core/ring power ratio to explore the impact on intermetallic phase formation and mechanical properties during remote laser welding of IF steel to 1050 aluminium. It was found that in conduction mode, the core/ring power ratio of 0.2 provided a larger surface area for bonding at the weld interface, and this was translated through the maximum lap-shear strength of 97.6 N/mm2 (joint efficiency 71%). Furthermore, this significantly reduced the Fe2Al5 intermetallic compound (IMC) thickness by 62% and total IMC thickness by 40% in contrast to a core-dominant beam (power ratio greater than one). In keyhole mode, cracking and lower lap-shear strengths were observed compared to the conduction mode. Notably, with a core/ring power ratio of 0.5 a significant grain refinement in the steel side of the weld was observed

Solidification of Aluminium Alloys Under Ultrasonication: An Overview

An overview of our investigations on solidification microstructure formation under ultrasonication in various Al alloys and comparison against unrefined or chemically modified microstructures under identical cooling conditions is presented. Primary α-Al grains show significant refinement under ultrasonication, even better than established chemical inoculation, in the small ingots investigated. Increased solute content appears to promote grain refining efficiency under ultrasonication. Regular lamellar eutectic in Al–33 wt%Cu was observed to degenerate into rounded particle morphology and the irregular eutectic of long Si plates in Al–11 wt%Si were spheroidised into compact form near the ultrasound radiator. Grain refinement under ultrasonication appears to originate from enhanced heterogeneous nucleation under cavitation showing distinct reduction in nucleation undercooling. Eutectic modification, on the other hand, appears to originate from coarsening as the strong fluid flow created under cavitation disturbs the thin diffusion boundary layer ahead of the eutectic growth front

A review: On the development of low melting temperature Pb-free solders

Pb-based solders have been the cornerstone technology of electronic interconnections for many decades. However, with legislation in the European Union and elsewhere having moved to restrict the use of Pb, it is imperative that new Pb-free solders are developed which can meet the long established benchmarks set by leaded solders and improve on the current generation of Pb free solders such as SAC105 and SAC305. Although this poses a great challenge to researchers around the world, significant progress is being made in developing new solder alloys with promising properties. In this review, we discuss fundamental research activity and its focus on the solidification and interfacial reactions of Sn-based solder systems. We first explain the reactions between common base materials, coatings, and metallisations, and then proceed to more complex systems with additional alloying elements. We also discuss the continued improvement of substrate resistance to attack from molten Sn which will help maintain the interface stability of interconnections. Finally, we discuss the various studies which have looked at employing nanoparticles as solder additives, and the future prospects of this field

A review of Laser Powder Bed Fusion Additive Manufacturing of aluminium alloys: Microstructure and properties

Additive manufacturing (AM) of metallic alloys for structural and functional applications has attracted significant interest in the last two decades as it brings a step change in the philosophy of design and manufacturing. The ability to design and fabricate complex geometries not amenable to conventional manufacturing, and the potential to reduce component weight without compromising performance, is particularly attractive for aerospace and automotive applications. This has culminated in rapid progress in AM with Ti- and Ni-based alloys. In contrast, the development of AM with Al-alloys has been slow, despite their widespread adoption in industry owing to an excellent combination of low density and high strength-to-weight ratio. Research to date has focused on castable and weldable AlSiMg-based alloys (which are less desirable for demanding structural applications), as well as on the development of new AM-specific AlMgSc alloys (based on 5xxx series). However, high strength wrought Al-alloys have typically been unsuitable for AM due to their unfavourable microstructural characteristics under rapid directional solidification conditions. Nevertheless, recent research has shown that there is promise in overcoming the associated challenges. Herein, we present a review of the current status of AM with Al-alloys. We primarily focus on the microstructural characteristics, and on exploring how these influence mechanical properties. The current metallurgical understanding of microstructure and defect formation in Al-alloys during AM is discussed, along with recent promising research exploring various microstructural modification methodologies. Finally, the remaining challenges in the development of AM with high-strength Al-alloys are discussed