Entwicklung der technologischen Grundlage fuer fortgeschrittene multifunktional Siliziumsysteme Abschlussbericht

For realization of multifunctional systems on the basis of CMOS processes and of the silicon bulk technique a modular process flow including a first-level essembly process has been developed for monolithic integrated mechanical sensors with piezoresistive signal transformation. For this process, from chip-chip- and from wafer-wafer-joining techniques additional moduls have been defined for realization of the 'chip on chip' technology for quasi monolithic multifunctional systems. Developments for the metal surface technique include galvanic processes for gold, nickel, nickel-iron, and copper, the UV lithography process for thick laquer layers (up to 100 #mu#m) and the sacrificial layer process for realization of 3D metal structures. Partial structures for magnetically driven membrane pumps and valves have been realized in a combined silicon bulk and metal surface technique. Additional development activities are directed to the multi-circuit 'Alice', the 1 #mu#m CMOS process and to interfaces between the IC design tools and the finite element simulator ANSYS. (WEN)SIGLEAvailable from TIB Hannover: F96B1234+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman