Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite

Aiming at developing high thermal conductivity copper/diamond composite, an unconventional approach applying self-assembled monolayer (SAM) prior to the high-temperature sintering of copper/diamond composite was utilized to enhance the thermal boundary conductance (TBC) between copper and diamond. The enhancement was first systematically confirmed on a model interface system by detailed SAM morphology characterization and TBC measurements. TBC significantly depends on the SAM coverage and ordering, and the formation of high-quality SAM promoted the TBC to 73 MW/m^2-K from 27 MW/m^2-K, the value without SAM. With the help of molecular dynamics simulations, the TBC enhancement was identified to be determined by the number of SAM bridges and the overlap of vibrational density of states. The diamond particles of 210 {\micro\metre} in size were simultaneously functionalized by SAM with the condition giving the highest TBC in the model system and sintered together with the copper to fabricate isotropic copper/diamond composite of 50% volume fraction. The measured thermal conductivity marked 711 W/m-K at room temperature, the highest value among the ones with similar diamond-particles volume fraction and size. This work demonstrates a novel strategy to enhance the thermal conductivity of composite materials by SAM functionalization

Nonequilibrium magnonic thermal transport engineering

Thermal conductivity, a fundamental parameter characterizing thermal transport in solids, is typically determined by electron and phonon transport. Although other transport properties including electrical conductivity and thermoelectric conversion coefficients have material-specific values, it is known that thermal conductivity can be modulated artificially via phonon engineering techniques. Here, we demonstrate another way of artificially modulating the heat conduction in solids: magnonic thermal transport engineering. The time-domain thermoreflectance measurements using ferromagnetic metal/insulator junction systems reveal that the thermal conductivity of the ferromagnetic metals and interfacial thermal conductance vary significantly depending on the spatial distribution of nonequilibrium spin currents. Systematic measurements of the thermal transport properties with changing the boundary conditions for spin currents show that the observed thermal transport modulation stems from magnon origin. This observation unveils that magnons significantly contribute to the heat conduction even in ferromagnetic metals at room temperature, upsetting the conventional wisdom that the thermal conductivity mediated by magnons is very small in metals except at low temperatures. The magnonic thermal transport engineering offers a new principle and method for active thermal management

Electron-phonon coupling and non-equilibrium thermal conduction in ultrafast heating systems

The electron-phonon coupling in ultrafast heating systems is studied within the framework of Boltzmann transport equation (BTE) with coupled electron and phonon transport. To directly solve the BTE, a discrete unified gas kinetic scheme is developed, in which the electron/phonon advection, scattering and electron-phonon interactions are coupled together within one time step by solving the BTE at the cell interface. Numerical results show that the present scheme can correctly predict the electron-phonon coupling constant, and is in excellent agreement with typical two-temperature model (TTM) and experimental results in existing literatures and our home-made time-domain thermoreflectance technique in ultrafast laser heating problem. In the transient thermal grating (TTG) geometry, the present scheme not only recovers the TTM in the diffusive regime, but also captures the ballistic and thermal wave effects when the characteristic length is comparable to or smaller than the mean free path where the TTM fails. More interestingly, an unexpected heat flow from phonon to electron is predicted in both the ballistic and diffusive regimes in the TTG geometry. It results from the competition of the thermal diffusivity and electron-phonon coupling in the diffusive regime, and in the ballistic regime it results from the competition of the phonon/electron advection and electron-phonon coupling.Comment: 12 pages, 6 figure

Thermal Transport in Soft PAAm Hydrogels

As the interface between human and machine becomes blurred, hydrogel incorporated electronics and devices have emerged to be a new class of flexible/stretchable electronic and ionic devices due to their extraordinary properties, such as softness, mechanically robustness, and biocompatibility. However, heat dissipation in these devices could be a critical issue and remains unexplored. Here, we report the experimental measurements and equilibrium molecular dynamics simulations of thermal conduction in polyacrylamide (PAAm) hydrogels. The thermal conductivity of PAAm hydrogels can be modulated by both the effective crosslinking density and water content in hydrogels. The effective crosslinking density dependent thermal conductivity in hydrogels varies from 0.33 to 0.51 Wm−1K−1, giving a 54% enhancement. We attribute the crosslinking effect to the competition between the increased conduction pathways and the enhanced phonon scattering effect. Moreover, water content can act as filler in polymers which leads to nearly 40% enhancement in thermal conductivity in PAAm hydrogels with water content vary from 23 to 88 wt %. Furthermore, we find the thermal conductivity of PAAm hydrogel is insensitive to temperature in the range of 25–40 °C. Our study offers fundamental understanding of thermal transport in soft materials and provides design guidance for hydrogel-based devices