1 research outputs found
Microstructural characterization of inlaid copper interconnect lines
- Author
- A. Diebold
- A. Huot
- A. Tezaki
- A.N. Campbell
- Brett Baker
- C. Lingk
- C. Lingk
- C. Lingk
- C. Ryu
- Cindy Simpson
- Cristiano Capasso
- D. Edelstein
- D.B. Knorr
- D.B. Knorr
- D.J. Dingley
- D.J. Dingley
- D.P. Field
- D.P. Field
- D.P. Tracy
- Delrose Winter
- E. Zschech
- E.M. Zielinski
- Ehrenfried Zschech
- Elizabeth Weitzman
- Greg Braeckelmann
- H. Toyoda
- Hisao Kawasaki
- J. Kasthurirangan
- J.A. Venables
- J.E. Sanchez
- J.M.E. Harper
- K.P. Rodbell
- L. Vanasupa
- Larry Zhao
- M. Kageyama
- Martin Gall
- Matt Herrick
- Mike Tiner
- P. Besser
- P.R. Besser
- P.R. Besser
- P.R. Besser
- P.R. Besser
- P.R. Besser
- Paul R. Besser
- R.P. Vinci
- R.P. Vinci
- Richard Ortega
- S. Vaidya
- S. Venkatasen
- Stacye Thrasher
- Stewart Rose
- T. Licata
- V. Randle
- Werner Blum
- Publication venue
- 'Springer Science and Business Media LLC'
- Publication date
- Field of study
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