Approaches for additive manufacturing of 3D electronic applications

AbstractAdditive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates

Approach for the identification of influencing factors and their effects on energy flexible production systems

Due to the expansion of renewable energies in Germany, the electrical energy supply is shifting to a complex volatile system. This work provides an approach for the identification of influencing factors and their effects on energy flexible production systems. Therefore, the system dynamic approach is extended by energy flexibility. As a result, a four-step method is presented that supports the energy and production manager in adapting the production system to the energy availability in the power grid. It is a matter of gaining an overview of the effects on the energy flexibility when typical variables are manipulated in production systems

Approaches for Additive Manufacturing of 3D Electronic Applications

AbstractAdditive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates