2 research outputs found
A Survey of Test and Reliability Solutions for Magnetic Random Access Memories
Memories occupy most of the silicon area in nowadays' system-on-chips and contribute to a significant part of system power consumption. Though widely used, nonvolatile Flash memories still suffer from several drawbacks. Magnetic random access memories (MRAMs) have the potential to mitigate most of the Flash shortcomings. Moreover, it is predicted that they could be used for DRAM and SRAM replacement. However, they are prone to manufacturing defects and runtime failures as any other type of memory. This article provides an up-to-date and practical coverage of MRAM test and reliability solutions existing in the literature. After some background on existing MRAM technologies, defectiveness and reliability issues are discussed, as well as functional fault models used for MRAM. This article is dedicated to a summarized description of existing test and reliability improvement methods developed so far for various MRAM technologies. The last part of this article gives some perspectives on this hot topic.Computer Engineerin
Multi-level control of resistive ram (Rram) using a write termination to achieve 4 bits/cell in high resistance state
RRAM density enhancement is essential not only to gain market share in the highly competitive emerging memory sector but also to enable future high-capacity and power-efficient brain-inspired systems, beyond the capabilities of today’s hardware. In this paper, a novel design scheme is proposed to realize reliable and uniform multi-level cell (MLC) RRAM operation without the need of any read verification. RRAM quad-level cell (QLC) capability with 4 bits/cell is demonstrated for the first time. QLC is implemented based on a strict control of the cell programming current of 1T-1R HfO2-based RRAM cells. From a design standpoint, a self-adaptive write termination circuit is proposed to control the RESET operation and provide an accurate tuning of the analog resistance value of each cell of a memory array. The different resistance levels are obtained by varying the compliance current in the RESET direction. Impact of variability on resistance margins is simulated and analyzed quantitatively at the circuit level to guarantee the robustness of the proposed MLC scheme. The minimal resistance margin reported between two consecutive states is 2.1 kΩ along with an average energy consumption and latency of 25 pJ/cell and 1.65 µs, respectively.Quantum & Computer EngineeringComputer Engineerin