107 research outputs found
Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires
Preface : Materials and Technologies for 3-D Integration - 2008 MRS Fall Meeting; Boston, MA; 1 December 2008 through 3 December 2008
3-dimensional integration (3D IC) is a system level architecture/technology wherein multiple layers of planar devices are stacked and vertically interconnected through the silicon substrate (or other semiconductor material) in the Z direction as shown in Figure 1
HP-04-002 BPH- and BPHsurgery-related ejaculation disorders: Results from a prospective observational trial
Functional outcomes after minimally invasive nephron sparing surgery: Are cT2a and cT1b tumors comparable in terms of kidney function impairment?
Functional outcomes after minimally invasive nephron sparing surgery: Can we compare cT2a and cT1b tumors in terms of kidney function impairment after surgery?
Deep Reactive Ion Etching of Through Silicon Vias
This chapter contains sections titled: • Introduction • DRIE Equipment and Characterization • DRIE Processing • Practical Solutions in Via Etching • Concluding Remarks • Appendix A: Glossary of Abbreviations • Appendix B: Examples of DRIE Recipes • Reference
Formation of Imino−Phosphine Bidentate Chelates by an Unprecedented Organopalladium Complex Promoted Oxidative Coupling Reaction between Diphenylvinylphosphine and Imines
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