107 research outputs found
Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires
Full text linkPreface : Materials and Technologies for 3-D Integration - 2008 MRS Fall Meeting; Boston, MA; 1 December 2008 through 3 December 2008
No full text3-dimensional integration (3D IC) is a system level architecture/technology wherein multiple layers of planar devices are stacked and vertically interconnected through the silicon substrate (or other semiconductor material) in the Z direction as shown in Figure 1
HP-04-002 BPH- and BPHsurgery-related ejaculation disorders: Results from a prospective observational trial
No full textFunctional outcomes after minimally invasive nephron sparing surgery: Are cT2a and cT1b tumors comparable in terms of kidney function impairment?
No full textFunctional outcomes after minimally invasive nephron sparing surgery: Can we compare cT2a and cT1b tumors in terms of kidney function impairment after surgery?
No full textDeep Reactive Ion Etching of Through Silicon Vias
No full textThis chapter contains sections titled: • Introduction • DRIE Equipment and Characterization • DRIE Processing • Practical Solutions in Via Etching • Concluding Remarks • Appendix A: Glossary of Abbreviations • Appendix B: Examples of DRIE Recipes • Reference
Formation of Imino−Phosphine Bidentate Chelates by an Unprecedented Organopalladium Complex Promoted Oxidative Coupling Reaction between Diphenylvinylphosphine and Imines
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