17 research outputs found

    Impact of pressure drop oscillations on surface temperature and critical heat flux during flow boiling in a microchannel

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    Flow boiling in microchannel heat sinks is capable of providing the high-heat-flux dissipation required for thermal management of next-generation wide bandgap power electronics at low pumping power and uniform surface temperatures. One of the primary issues preventing implementation of these technologies is the presence of flow boiling instabilities, which may reduce the heat transfer performance. However, the effect of individual instabilities, such as the parallel channel instability or pressure drop oscillations, on the overall heat transfer coefficient and critical heat flux in microchannel heat sinks has not been fully quantified. The primary cause of these dynamic flow boiling instabilities is the interaction between the inertia of a two-phase mixture in a heated channel and sources of compressibility located upstream of the inlet. In order to isolate the effect of pressure drop oscillations on flow boiling heat transfer performance, experiments are performed in a single square microchannel cut into a copper heat sink, with a controlled level of upstream compressibility. The impact of pressure drop oscillations on the heat transfer coefficient and critical heat flux is characterized through analysis of both time-averaged steady-state data as well as high-frequency pressure signals synchronized with high-speed visualization. The dielectric working fluid HFE-7100 is used in all experiments with a saturation temperature of 60°C at the channel outlet pressure. The occurrence and effect of pressure drop oscillations in 20 mm long microchannels of three different channel widths (0.5, 0.75, and 1 mm) are related to mass flux, the degree of two-phase flow confinement, and the severity of pressure drop oscillations

    A semi-empirical model for thermal resistance and dryout during boiling in thin porous evaporators fed by capillary action

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    Two-phase passive heat transport devices such as vapor chambers, loop heat pipes, and capillary pumped loops utilize porous evaporators for phase change and to drive fluid transport. Nucleate boiling can occur within such capillary-fed porous evaporators, especially under high-heat-flux operation, as has been visually observed in various experimental studies in the literature. However, prior modeling efforts have typically only considered single-phase flow of liquid through a completely saturated porous medium for characterizing the dryout limit and thermal performance. The present work offers a new semi-empirical model for prediction of thermal resistance and dryout during boiling in capillary-fed evaporators. Thermal conduction across the solid and volumetric evaporation within the pores are solved to obtain the temperature distribution in the porous structure. Capillary-driven lateral liquid flow from the outer periphery of the evaporator to its center, with vapor flow across the thickness, is considered to obtain the local liquid and vapor pressures. The capillary pressure and the relative permeabilities (fraction of single-phase permeabilities) for two-phase flow in the porous medium are modeled as a function of the local liquid saturation. The heat flux at which the liquid saturation at the center of the evaporator becomes zero is defined as the dryout limit of the evaporator. Experiments are conducted on sintered copper particle evaporators of different particle sizes and heater areas to collect data for model calibration. To demonstrate the wider applicability of the model for other types of porous evaporators, the model is further calibrated against a variety of dryout limit and thermal resistance data collected from the literature. The model is shown to predict the experimentally observed trends in the dryout limit with mean particle/pore size, heater size, and evaporator thicknesses

    The effect of uneven heating on the flow distribution between parallel microchannels undergoing boiling

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    As the size, weight, and performance requirements of electronic devices grow increasingly demanding, their packaging has become more compact. As a result of thinning or removing the intermediate heat spreading layers, non-uniform heat generation from the chip-scale and component-level variations may be imposed directly on the attached microchannel heat sink. Despite the important heat transfer performance implications, the effect of uneven heating on the flow distribution in parallel microchannels undergoing boiling has been largely unexplored. In this study, a two-phase flow distribution model is used to investigate the impact of uneven heating on the flow distribution behavior of parallel microchannels undergoing boiling. Under lateral uneven heating (i.e., the channels are each heated to different levels, but the power input is uniform along the length of any given channel), it is found that the flow is significantly more maldistributed compared to the even heating condition. Specifically, the range of total flow rates over which the flow is maldistributed is broader and the maximum severity of flow maldistribution is higher. These trends are assessed as a function of the total input power, degree of uneven heating, and the extent of thermal connectedness between the channels. The model predictions are validated against experiments for a representative case of thermally isolated and coupled channels subjected to even heating and extreme lateral uneven heating conditions and show excellent agreement

    A figure of merit to characterize the efficacy of evaporation from porous microstructured surfaces

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    Evaporation from porous structured surfaces is encountered in a variety of applications including electronics cooling, desalination, and solar energy generation. Of major interest in the design of thermal systems for such applications is a prediction of the heat and mass transfer rates during evaporation from these surfaces. The present study develops a figure of merit (FOM) that characterizes the efficacy of evaporative heat transfer from microstructured surfaces. Geometric quantities such as the contact line length per unit area, porosity, and contact angle that are independent of details of the surface structure are utilized to develop the FOM, allowing for flexibility in its application to a variety of structured surfaces. This metric is calibrated against an evaporative heat transfer model and further benchmarked with evaporation heat transfer data from the literature. The FOM successfully captures the variation in evaporation heat transfer coefficient across different structures as well as the optimum dimensions for a given structure, and therefore can serve as a tool to survey available structures and also optimize their dimensions for heat and mass transfer enhancement

    Transient flow boiling and maldistribution characteristics in heated parallel channels induced by flow regime oscillations

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    Flow boiling provides an effective means of heat removal but can suffer from thermal and hydrodynamic transients that compromise heat transfer performance and trigger device failure. In this study, the transient flow boiling characteristics in two thermally isolated, hydrodynamically coupled parallel microchannels are investigated experimentally. High-speed flow visualization is synchronized to high-frequency heat flux, wall temperature, pressure drop, and mass flux measurements to provide time-resolved characterization. Two constant and two transient heating conditions are presented. For a constant heat flux of 63 kW/m2 into each channel, boiling occurs continuously in both channels and the parallel channel instability is observed to occur at 15 Hz. Time-periodic oscillations in the pressure drop and average mass flux are observed, but corresponding oscillations in the wall temperatures are virtually non-existent at this condition. At a slightly lower constant heat flux of 60 kW/m2, boiling remains continuous in one of the channels, but the other channel experiences time-periodic flow regime oscillations between single-phase and two-phase flow. At this condition, extreme time-periodic wall temperature oscillations are observed in both channels with a long period (~7 s) due to oscillations in the severity of the flow maldistribution. For the transient heating conditions, square wave heating profiles oscillating between different heat flux levels are applied to the channels. Because of their relatively high frequency, the heating transients are attenuated by the microchannel walls, resulting in effectively constant heating conditions and flow boiling characteristics like that of the aforementioned constant heating conditions. This study illustrates the susceptibility of parallel two-phase heat sinks to flow maldistribution, particularly when undergoing transient flow regime oscillations

    Optimization of Thermal Interface Materials for Electronics Cooling Applications

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    Compressed-Liquid Energy Storage with an Adsorption-based Vapor Accumulator for Solar-Driven Vapor Compression Systems in Residential Cooling

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    A cycle-integrated energy storage strategy for vapor-compression refrigeration is proposed wherein thermo-mechanical energy is stored as compressed liquid.A compressed-liquid tank is integrated into the liquid line of the system by means of an adsorption-based vapor accumulator in the vapor line. Energy is retrieved through expansion of the compressed liquid, which allows for a tunable evaporator temperature. A thermodynamic model is developed to assess the system performance, with storage incorporated, for solar residential cooling in two locations with contrasting ambient temperature profiles. Ammonia, R134a, and propane, all paired with activated carbon as adsorbent, are evaluated.A high cold thermal energy storage density is achieved when operated with ammonia. However, the accumulator suppresses the coefficient of performance of the system because work is required to extract refrigerant from the adsorbent. Practical feasibility of the proposed storage strategy calls for the development of nontoxic refrigerant–adsorbent pairs with more favorable adsorption behavior

    Analysis of a Phase Change Energy Storage System for Pulsed Power Dissipation

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    Carbon Nanotube Coatings for Enhanced Capillary-Fed Boiling from Porous Microstructures

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    Due to their high intrinsic thermal conductivity, carbon nanotubes (CNTs) have previously been incorporated into a variety of thermal management applications to improve cooling performance. Implementation of controlled CNT growth techniques and functionalization methods are applied herein to enhance boiling heat transfer from the porous capillary wicking surfaces widely used in high heat flux thermal management devices. A microwave plasma-enhanced chemical vapor deposition (MPCVD) synthesis process resulted in growth of a permeable CNT coating, and physical vapor deposition of copper over these nanotubes yielded the requisite hydrophilic wicking surface. An array of test samples was fabricated and then evaluated using an experimental test facility to determine the reduction in surface temperature resulting from CNT coating and micropatterning of the porous surfaces under two-phase heat transfer conditions with water as the working fluid. Both CNT coating and micropatterning techniques were able to provide significant performance enhancements, reducing the surface superheat up to 72% compared to baseline tests and eliminating disad- vantageous temperature overshoot corresponding to boiling incipience. Such performance gains are attributable to the formation of nanoporous cavities that increase nucleation site density and high permeability vents through which vapor can readily depart the surface under vigorous boiling conditions. The synthesis procedures developed that result in the observed enhancement can be readily incorporated into currently employed devices
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