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3 research outputs found
Thiol-Based Self-Assembled Monolayers (SAMs) as an Alternative Surface Finish for 3D Cu Microbumps
Author
A Maestre Caro
A Manna La
+4Â more
G Vakanas
G Vakanas
H YHsiao
L England
Publication venue
'Wiley'
Publication date
01/01/2015
Field of study
No full text
Crossref
Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers
Author
A. S. M. A. Haseeb
B Lee
+27Â more
C Chen
C Wang
C Wang
C Wang
C Wang
C Wang
C Wang
Ee Lynn Lee
F Gao
G Humpston
G Vakanas
GP Vassilev
JH Westbrook
KC Chan
L Liu
L Magagnin
M Jiang
Meng Teck Ong
P Limaye
S Chen
SY Jang
W Zhu
WK Choi
Y Goh
Y Goh
Yi Sing Goh
Yingxin Goh
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Effect of Ni Content on the Microstructure Formation and Properties of Sn-0.7Cu-xNi Solder Alloys
Author
A Ning
AA El-Daly
+53Â more
AA El-Daly
AF Abd El-Rehim
BL Silva
BL Silva
C Andersson
CD Zou
CML Wu
G Khatibi
G Vakanas
G Zeng
G Zeng
H Huang
H Ma
H Wang
Hengtao Zhai
Hongxia Gao
HR Kotadia
J Bang
J Cheng
J Fan
J Fan
J Koo
J Shen
J Wang
Jianglei Fan
Jianxiu Liu
JW Xian
K Nogita
K Zeng
L Yang
L Yang
LF Li
M Felberbaum
M Zhao
MA Fazal
MAA Mohd Salleh
MGC Xavier
MJ Rizvi
MJ Rizvi
MN Bashir
S Huh
T El-Ashram
T Laurila
T Maeshima
T Ventura
TL Yang
W Liao
Xiao Wang
Y Kim
Y Li
Y Tang
Ying Li
Zhanyun Liu
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref