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6 research outputs found

The Connection between Microstructural Damage Modeling and Continuum Damage Modeling for Eutectic Sn-Pb Solder Alloys

Author: A. Dasgupta
Akay H.
Basaran C.
Coffin L.F.
Coffin L.F.
Darveaux R.
Desai C.S.
Frear D.
Frear D.R.
G. Cuddalorepatta
Giessen E.V.D.
Kachanov L.M.
Knecht S.
Kuo C.G.
Lau J.
P. Sharma
Riedel H.
Sandor B.
Shine M.C.
Solomon H.D.
Tanaka M.
Vaynman S.
Vaynman S.
Publication venue: 'SAGE Publications'
Publication date
Field of study

Realistic Creep Characterization for Sn3.0Ag0.5Cu Solder Joints in Flip Chip BGA Package

Author: D Herkommer
D Herkommer
D Herkommer
D Lecompte
D Lunt
EH Amalu
G Cuddalorepatta
Ho Hyung Lee
J Kwak
J Sun
Jae B. Kwak
JH Lau
JH Lau
KA Kasvayee
P Lall
PT Vianco
Q Xiao
R Darveaux
RD Pendse
S Hamada
S Mukherjee
S Park
TR Bieler
Y Sun
Y Yuan
Y Yuan
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Studies of Interfacial Microstructures and Series Resistance on Electroplated and Hot-Dipped Sn-xCu Photovoltaic Modules

Author: CM Chen
Fei-Yi Hung
FY Hung
G Cuddalorepatta
H Zou
J Shen
JW Yoon
JW Yoon
K Nishioka
K Zeng
KJ Chen
KJ Chen
KS Bae
KS Kim
Kuan-Jen Chen
Lin Hsu
M Sadeghi
M Tan
MS Park
N Saunders
N Zhao
RJ Handy
S Choi
T Laurila
Truan-Sheng Lui
WT Chen
X Deng
Y Tian
YG Lee
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints

Author: A. Dasgupta
B Zhou
BQ Han
D Henderson
DDPL Snugovsky
E Arzt
E Arzt
G Cuddalorepatta
I Dutta
J Gong
J Keller
J Preußner
J Rosler
J Rösler
M. Osterman
M. Pecht
N Iosipescu
NS Brar
P. Chauhan
RW Weeks
S Mukherjee
S Mukherjee
S. Mukherjee
SL Allen
T Chen
T Mura
T Reinikainen
T-K Lee
TR Bieler
TY Lee
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Uniaxial Ratchetting Behavior of Solder Alloys and Its Simulation by an Elasto-Plastic-Creep Constitutive Model

Author: A Zamiri
C Basaran
C Basaran
C-Y Fu
C-Y Fu
D Herkommer
DL McDowell
F Ochoa
G Cuddalorepatta
GZ Wang
H Ishikawa
H Ishikawa
H Ishikawa
H Ma
HD Solomon
K Nakane
K Ohguchi
K Ohguchi
K Ohguchi
K Ohguchi
K Sasaki
K Sasaki
K Sasaki
Katsuhiko Sasaki
Ken-ichi Ohguchi
L Maciucescu
M Kerr
M Kobayashi
M Nozaki
MB Ruggles
MW Woodmansee
R Chandary
RS Whitelaw
S Vaynmann
S Wises
S Yi
W Ren
XQ Shi
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

Author: AR Fix
AU Telang
CW Nan
DS Wilkinson
DW Henderson
E Arzt
F Ochoa
F Ochoa
F Yang
FA Dilmanian
G Cuddalorepatta
I Dutta
I Dutta
I Dutta
I Ohnuma
IE Anderson
J Gong
J Gong
JJ Sundelin
John Botsis
Joë Cugnoni
K Jung
KE Yazzie
KS Kim
KS Kim
KW Moon
M Kerr
M Kouzeli
M Maleki
M Maleki
M Rappaz
MD Mathew
MD Uchic
Milad Maleki
ML Huang
N Chawla
P Kumar
PT Vianco
RA Gagliano
RJ McCabe
RS Sidhu
RS Sidhu
RS Sidhu
RS Sidhu
S Wiese
SL Allen
SW Chen
T Laurila
W Kurz
X Deng
YD Han
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

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