Influence of the high-power ion-beam irradiation of a hydroxyapatite target on the properties of formed calcium phosphate coatings

The physical-mechanical of properties of biocompatible calcium phosphate coatings deposited onto titanium and silicon substrates from erosion materials, which are generated by irradiating hydroxyapatite (synthetic and natural) targets by means of the high-power pulsed ion beam of a Temp-4 accelerator, are investigated. A calculation technique for predicting the rate and energy efficiency of deposition using pulsed ion beams is proposed. Their characteristics are analyzed as applied to the formation of calcium phosphate coatings

Chromium films deposition by hot target high power pulsed magnetron sputtering: Deposition conditions and film properties

This study focuses on the deposition conditions, structural and mechanical properties of Cr films obtained by magnetron sputtering with hot target, and using high power pulsed supply with pre-ionization (pulse frequency 500 Hz, duty cycle 4% in the range of averaged power from 15 to 40 W/cm2). It has been found that hot target leads to a tenfold increase in the energy flux to the substrate compared to magnetron sputtering with cooled target. Intense sublimation from the target allows increasing the deposition rate of Cr films of about an order of magnitude. Moreover, the increase in the magnetron power may be accompanied by less heating of the substrates when depositing films of the same thickness. High power pulsed magnetron sputtering (HPPMS) with sublimating Cr hot target can be characterized by a combined mode in the film structure formation, leading to the formation of pores at the initial stage of growth. Cr films with a thickness of about 10 μm, obtained using a hot target, have lower surface roughness, hardness, and Young's modulus compared with sputtered Cr from a cooled targe

Hot target magnetron sputtering for ferromagnetic films deposition

This work is an investigation on the operation parameters for Ni films deposition by magnetron sputtering from target working at temperatures higher than the Curie temperature due to magnetic phase transition of the sputtered target, which is partial heat-insulated from the water-cooled magnetron body. The ferro- to paramagnetic transition of the target results in decrease of discharge voltage and rise of discharge current. Thereby, discharge power increases under voltage control mode or hot Ni target sputtering can occur at lower pressures under power control mode. Heating of the Ni target and its ferro- to paramagnetic transition leads to stabilization of the discharge parameters. The changes of the discharge current and power decreased from 10.5% to 2.5% during a single sputtering process under voltage control mode. Moreover, a slight increase of the deposition rates of 20…25% was determined, when hot target sputtering was performed. The XRD assessment showed that Ni films deposited by hot target sputtering have a textured crystal structure with larger grain sizes and lower residual stresses in comparison with cooled Ni target sputtering. When passing from cooled to hot target sputtering, the type of film growth changes from zone 1 to zone T, and surface roughness of Ni films decreased