6 research outputs found
3D sensors for the HL-LHC
In order to increase its discovery potential, the Large Hadron Collider (LHC)
accelerator will be upgraded in the next decade. The high luminosity LHC
(HL-LHC) period demands new sensor technologies to cope with increasing
radiation fluences and particle rates. The ATLAS experiment will replace the
entire inner tracking detector with a completely new silicon-only system. 3D
pixel sensors are promising candidates for the innermost layers of the Pixel
detector due to their excellent radiation hardness at low operation voltages
and low power dissipation at moderate temperatures. Recent developments of 3D
sensors for the HL-LHC are presented.Comment: 8 pages, 5 figures, International Workshops on Radiation Imaging
Detectors 201
3D silicon pixel detectors for the High-Luminosity LHC
3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50 × 250 μm(2) large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12–15 mW/cm(2) at a fluence of about 10(16) n(eq)/cm(2), measured at -25°C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50 × 50 and 25 × 100 μm(2), matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1–2 V before irradiation.3D silicon pixel detectors have been investigated as radiation-hard candidates for the innermost layers of the HL-LHC upgrade of the ATLAS pixel detector. 3D detectors are already in use today in the ATLAS IBL and AFP experiments. These are based on 50x250 um2 large pixels connected to the FE-I4 readout chip. Detectors of this generation were irradiated to HL-LHC fluences and demonstrated excellent radiation hardness with operational voltages as low as 180 V and power dissipation of 12--15 mW/cm2 at a fluence of about 1e16 neq/cm2, measured at -25 degree C. Moreover, to cope with the higher occupancies expected at the HL-LHC, a first run of a new generation of 3D detectors designed for the HL-LHC was produced at CNM with small pixel sizes of 50x50 and 25x100 um2, matched to the FE-I4 chip. They demonstrated a good performance in the laboratory and in beam tests with hit efficiencies of about 97% at already 1--2V before irradiation