Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu6(In,Sn)5 near the Cu substrate and the Cu-deficient Cu(In,Sn)2 near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

The low melting temperature In-48Sn alloy is a promising candidate for flexible devices. However, the joint strength of the In-48Sn alloy on the Cu substrate was low due to the rapid diffusion of Cu into the In-rich alloy. In this study, the effect of the addition of xCu (x = 2.0 and 8.0 wt.%) on wettability, interfacial reaction, and mechanical strength of the In-Sn-xCu/Cu joint is analyzed. The results demonstrate that both the In-48Sn and In-Sn-xCu alloys exhibit good wettability on the Cu substrate and that the contact angle increases with an increase in the Cu content. Furthermore, fine grains are observed in the alloy matrix of the In-Sn-xCu/Cu joint and the interfacial intermetallic compound (IMC) comprising the Cu-rich Cu6(In,Sn)5 near the Cu substrate and the Cu-deficient Cu(In,Sn)2 near the solder side. The In-Sn-2.0Cu/Cu joint with fine microstructure and a small amount of IMC in the alloy matrix shows the highest average shear strength of 16.5 MPa. Although the In-Sn-8.0Cu/Cu joint also exhibits fine grains, the presence of large number of voids and rough interfacial IMC layer causes the formation of additional stress concentration points, thereby reducing the average shear strength of the joint

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Formic acid (FA) atmosphere is promising to achieve chemical reduction at the oxidized surfaces of the solder and matrix material during soldering, replacing chemical flux being challenging as the continuous decrease in the pitch of solder bump in a three-dimensional integrated circuit. Although a previous study observed the effect of Sn steaming on the wettability of the solder during FA soldering, it has not been understood yet by adequate studies. This study demonstrates the fluxless soldering behavior of Sn-3.0Ag-0.5Cu (SAC) solder/Cu under FA atmosphere. Resembling vulcanian eruption Sn steaming occurred with a solid-state Sn and promoted Sn–Cu intermetallic compound (IMC) formations obviously at temperature (210 ° C) lower than the melting temperature of Sn (231 ° C). As indicated by in-situ observations, the IMC formations led to the final spreading area of solder under FA soldering was larger than that under the soldering with rosin mildly activated (RMA) flux. The wettability of SAC solder under FA atmosphere could be improved with continuous heating