MicroCar 2003 Abstracts of papers

Mechatronics for automotive applications is an important trend, combining mechanics, electronics and information technology. Micro- and nanomechatronics, particularly innovative research disciplines, will help create, in combination with advanced solutions from microsystem technologies, e.g. the electronic packaging, a range of entirely new developments in automobiles. Under the umbrella of the Automotive Suppliers Fair Z2003, it is happening for the very first time now that a momentous scientific conference, such as the MicroCar 2003, brings together representatives from car manufacturers and the electronics industry, as well as a large number of experts from technical colleges, universities and research institutes to discuss the new potentials and possibilities presented by the use of micro and nanomaterials in Leipzig. With the presentation of 50 papers, speakers will inform about their latest research results as well as current trends in micro and nanotechnologies for automotives. This issue is publishing the abstracts of this scientific event.Available from TIB Hannover / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekSIGLEDEGerman

ECOMOD - Entwicklung einer oekonomischen, auf keramischen Traegern basierenden Multi-Chip-Technik. Teilvorhaben: Entwicklung einer kostenguenstigen und entsorgungsgerechten Technologie fuer Mikrosysteme, Kfz- und Konsumgueter-Industrie Abschlussbericht

Available from TIB Hannover: F99B1364+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekSIGLEBundesministerium fuer Bildung und Forschung (BMBF), Bonn (Germany); European Union (Euro), Brussels (Belgium)DEGerman

Erforschung des Einsatzpotentials biomimetischer Verfahren zur Selbstassemblierung optoelektrischer Komponenten in der Mikrosystemtechnik am Beispiel von Purpurmembran-Elektroden-Arrays. Teilvorhaben: Praeparation mikroskaliger Goldfeinstleiterstrukturen und Charakterisierung darauf realisierter bioelektronischer Hybridstrukturen Schlussbericht

Available from TIB Hannover: F05B278 / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekSIGLEBundesministerium fuer Bildung und Forschung (BMBF), Bonn (Germany)DEGerman

IZM annual report 2001/2002

SIGLEAvailable from TIB Hannover: ZL 2152(2001/2002) / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekDEGerman

Integrierbarer multimodaler Empfaenger fuer mobile Kommunikation. Teilvorhaben: HF optimierte mehrlagige Verdrahtung in Hybrid MCM Abschlussbericht

The planar integration concept for the realization of complex systems developed by the Fraunhofer Institute-IZM and -ISiT has been examined and optimized in terms of high frequency application for mobile communication systems. A special module with active and passive components was designed and realized for application in the frequency range of 2 GHz to 15 GHz. A thinfilm multilayer process was modified in terms of material selection and process parameters to meet the requirements of good signal transmission properties. Special test structures (such as vias and meander) which were integrated in the module were used to characterize the thinfilm process. The signal transmission properties were investigated in the frequency range up to 15 GHz. Furthermore the influence of process steps was investigated on the functionality of active CMOS-ICs. The final result are: - The planar integration concept is suited to realize multichip modules in the frequency range higher then 2 GHz. - The results in terms of technological parameters and design rules were used for the design of a DECT DCR receiver. - Each part of processing the modules in reference to the testchips inspected by ISiT has caused no problems on principle. The checked IC parameters are within the supposed limits after different process steps during the hole integration process. (orig.)SIGLEAvailable from TIB Hannover: F98B614+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman

Mikrofabrikationstechniken fuer Mikrosysteme - #mu#Fab Handbuch

Available from TIB Hannover: F97B1411+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekSIGLEBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman

In situ-Messtechniken fuer Mikrofabrikationstechniken Gemeinsamer Abschlussbericht

By virtue of their non-touch and non-destructive principle it is that optical measuring and testing techniques, especially when employed in the area of MEMS (micro electrical and mechanical systems), are highly suitable for microfabrication. Because of the diversity of the materials used in MEMS and the nature of their surfaces, it is necessary to use different optical measuring techniques. The microcomponents or complete MEMS' are automatically channelled into the measuring module, where they can be tested and examined. The module can be evacuated for the duration of measuring and testing processes. Simultaneously, an electrical wiring-up of the examinees, e.g. for function tests, is possible. The whole process, from the input of the measuring object over the measuring process up to the output, occurs automatically, likewise a corresponding 'superior/inferior' quality decision can be obtained. Besides 3D-measurement techniques, a multispectral ellipsometer for the characterization of optical layers and the gray scale correlation used for the determination of surface shift can be used. The measuring module can be used as an independent solution, or can be bound in existing technological clusters. In the pertinent SMIF (standard mechanical interface) transport boxes, the measuring objects are protected from atmospheric contamination (cleanroom independence). The module was conceptualized especially for the quality supervision in manufacturing MEMS with small to medium numbers of pieces. (orig.)SIGLEAvailable from TIB Hannover: F99B1071 / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung und Forschung (BMBF), Bonn (Germany)DEGerman

PROKOSMOS - Produktionstechniken und Bauweisen zur Kostenreduktion und Leistungssteigerung von Modulen der Hoechstfrequenztechnik (30-100 GHz) fuer die Serienfertigung Abschlussbericht

SIGLEAvailable from TIB Hannover: F03B1491 / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung und Forschung, Berlin (Germany)DEGerman

Qualifikations- und Pruefzentrum fuer elektronische Baugruppen Schlussbericht

SIGLEAvailable from TIB Hannover: DtF QN1(90,23) / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman

ISAMIG. Teilvorhaben: Mechanisch-thermische Charakterisierung und Test additiver integrierter Sensoren Abschlussbericht

SIGLEAvailable from TIB Hannover: DtF QN1(88,36) / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung und Forschung, Berlin (Germany)DEGerman