High-Frequency (> 100 GHz) Electronic Devices

Contains reports on five research projects and a list of publications.MIT Lincoln LaboratoryNational Aeronautics and Space Administration Grant NAG2-693National Science Foundation Grant ECS 91-09330Defense Advanced Research Projects Agency Contract MDA972-90-C-0021U.S. Army - Research Office Grant DAAL03-92-G-025

High-Frequency (> 100 GHz) Electronic Devices

Contains reports on four research projects, the research facility and a list of publications.Defense Advanced Research Projects Agency Contract MDA972-90-C-0021National Aeronautics and Space Administration Grant NAG2-693National Science Foundation Grant ECS 91-0933

High-Frequency (> 100 GHz) and High-Speed (< 1 ps) Electronic Devices

Contains reports on six research projects and a list of publications.MIT Research Laboratory of Electronics Postdoctoral FellowshipNational Science Foundation Grant DMR 90-22933MIT Lincoln Laboratory Advanced Concept ProgramAdvanced Research Projects Agency Contract MDA972-90-C-0021MIT Lincoln LaboratoryNational Aeronautics and Space Administration Grant NAG2-693U.S. Army Research Office Grant DAAL03-92-G-025

Optics and Quantum Electronics

Contains reports on ten research projects.Joint Services Electronics Program (Contract DAALO3-86-K-0002)National Science Foundation (Grant ECS 83-05448)National Science Foundation (Grant ECS 83-10718)National Science Foundation (Grant ECS 82-11650)National Science Foundation (Grant ECS 84-13178)National Science Foundation (Grant ECS 85-52701)US Air Force - Office of Scientific Research (Contract AFOSR-85-0213)National Institutes of Health (Contract 5-RO1-GM35459)U.S. Navy - Office of Naval Research (Contract N00014-86-K-0117

Borrelia burgdorferi sensu lato in Ixodes ricinus ticks collected from migratory birds in Southern Norway

<p>Abstract</p> <p>Background</p> <p><it>Borrelia burgdorferi </it>sensu lato (s.l.) are the causative agent for Lyme borreliosis (LB), the most common tick-borne disease in the northern hemisphere. Birds are considered important in the global dispersal of ticks and tick-borne pathogens through their migration. The present study is the first description of <it>B. burgdorferi </it>prevalence and genotypes in <it>Ixodes ricinus </it>ticks feeding on birds during spring and autumn migration in Norway.</p> <p>Methods</p> <p>6538 migratory birds were captured and examined for ticks at Lista Bird Observatory during the spring and the autumn migration in 2008. 822 immature <it>I. ricinus </it>ticks were collected from 215 infested birds. Ticks were investigated for infection with <it>B. burgdorferi </it>s.l. by real-time PCR amplification of the 16S rRNA gene, and <it>B. burgdorferi </it>s.l. were thereafter genotyped by melting curve analysis after real-time PCR amplification of the <it>hbb </it>gene, or by direct sequencing of the PCR amplicon generated from the <it>rrs </it>(16S)-<it>rrl </it>(23S) intergenetic spacer.</p> <p>Results</p> <p><it>B. burgdorferi </it>s.l. were detected in 4.4% of the ticks. The most prevalent <it>B. burgdorferi </it>genospecies identified were <it>B. garinii </it>(77.8%), followed by <it>B.valaisiana </it>(11.1%), <it>B. afzelii </it>(8.3%) and <it>B. burgdorferi </it>sensu stricto (2.8%).</p> <p>Conclusion</p> <p>Infection rate in ticks and genospecies composition were similar in spring and autumn migration, however, the prevalence of ticks on birds was higher during spring migration. The study supports the notion that birds are important in the dispersal of ticks, and that they may be partly responsible for the heterogeneous distribution of <it>B. burgdorferi </it>s.l. in Europe.</p

Heterostructures for Optical Devices

Contains research objectives and reports on eight research projects.Joint Services Electronics Program (Contract DAAL03-86-K-0002)Joint Services Electronics Program (Contract DAALO3-89-C-0001)National Science Foundation (Grant EET 87-03404)Charles Stark Draper Laboratory (Contract DL-H-315251)Xerox Corporation FellowshipMIT Fund

Microstructural Evolution in Thin Films of Electronic Materials

Contains reports on ten research projects.Joint Services Electronics Program Contract DAAL03-89-C-0001National Science FoundationU.S. Air Force - Office of Scientific Research Contract AFOSR 85-0154Semiconductor Research CorporationAT&TInternational Business Machines CorporationNational Institutes of Healt

Microstructural Evolution in Thin Films of Electronic Materials

Contains reports on eight research projects.National Science Foundation (Grant ECS 85-06565)U.S. Air Force - Office of Scientific Research (Contract AFOSR 85-0154)National Science Foundation-Materials Research Laboratory(Grant DMR 81-19285)National Science Foundation (Grant DMR 85-06030)International Business Machines, Inc. Faculty Development AwardMitsui Career Development AwardInternational Business Machines, Inc.Semiconductor Research Corporation (Contract 86-05-080)Joint Services Electronics Program (Contract DAAG-29-83-K-0003)Charles Stark Draper LaboratoryDefense Advanced Research Projects Agency (DARPA)Nippon Telegraph and Telephone, Inc

Compound Semiconductor Materials and Devices

Contains table of contents for Part I, table of contents for Section 1, an introduction, reports on fourteen research projects and a list of publications.Defense Advanced Research Projects Agency/National Center for Integrated Photonics TechnologyJoint Services Electronics Program Grant DAAH04-95-1-0038MIT Lincoln LaboratoryNational Science Foundation Graduate FellowshipU.S. Navy - Office of Naval ResearchAT&T Bell Laboratories FellowshipU.S. Army - Ft. MeadeNTT CorporationNational Science FoundationLockheed-Martin Corporatio