An instrumented saxophone mouthpiece and its use to understand how an experienced musician play

International audienceAn instrumented saxophone mouthpiece has been developed to measure, during the player's performance, the evolution of important variables: the mouth pressure, the mouthpiece pressure and the force applied on the reed by the lower lip. Moreover, according to the pressure signals in the mouth and in the mouthpiece, the instantaneous ratio of the vocal tract input impedance and of the saxophone input impedance is estimated at frequencies multiple of the playing frequency (using the concept of Gabor mask). On the selected sound examples, analyses reveal many aspects of the strategies of the player. First of all, the role of the vocal tract in the characteristics of the sound production is sometimes prominent. Secondly, the sound production on the desired note (and register) as well as pitch correction seem to be the result of complementary adjustments of the mouth pressure and of the lip pressure on the reed. This is not in agreement with musicians feeling, since they often claim to let their force on the reed unchanged during the note and from note to note

Les déterminants politiques des processus de cloisonnement/ décloisonnement du gouvernement forestier en France

[Departement_IRSTEA]Territoires [TR1_IRSTEA]DTAMNational audienceLe modèle français de gouvernement forestier est actuellement souvent critiqué pour son manque d’ouverture sur la société et pour son incapacité à répondre de manière satisfaisante aux nouveaux enjeux économiques et environnementaux. Cette situation est généralement attribuée au fait que ce modèle est très centralisé (cloisonnement territorial) et se structure autour d’un champ social nettement différencié (cloisonnement sectoriel). On fait alors l’hypothèse dans ce chapitre que ce phénomène traduit l’existence d’une perte de synchronisation entre le territoire de référence du cadre politico-administratif forestier, qui est la nation, et les territoires mobilisés dans les processus économiques et sociaux relatifs à la gestion des forêts et à leur mise en valeur, qui s’inscrivent eux dans des échelles multiples. Ainsi en analysant la sociogenèse du Régime sectoriel forestier, on montre que l’Etat a construit et maintenu son pouvoir dans le domaine forestier en imposant un modèle de gouvernement sectoriel et centralisé en phase avec le principe moderne d’Etat-nation. Or, le contexte actuel de désynchronisation territorial remet en cause ce modèle et provoque des changements. En s’intéressant notamment aux enjeux infranationaux du processus de resynchronisation territoriale, on montre alors que la dimension locale des problèmes publics forestiers est de plus en plus politisée et que les collectivités territoriales s’impliquent parfois activement dans le débat forestier. Néanmoins, non seulement les rapports de médiation entre les porteurs d’intérêts socio-économiques et les acteurs publics se structurent encore aujourd’hui de manière verticale et sectorielle, mais surtout l’autorité en charge du traitement des problèmes forestier demeure principalement l’Etat

RF Characterization, Analysis and Miniaturization Impact of RDL Interconnects

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Behaviour of CPW and TFMS lines at high temperature for RF applications in sub-45 nm nodes

Coplanar waveguide (CPW) and thin film microstrip (TFMS) lines integrating porous ultra low-k as inter-metal dielectric layers (k = 2.5) and copper as metal. are for the first time experimentally measured up to 110 GHz and under different temperature conditions, up to 200 degrees C. The extracted attenuation and propagation coefficients of those transmission lines are compared to simulations performed with MAGWEL software, a frequency domain 3-D Maxwell solver. Based on the characterization results some guidelines related to interconnect design are presented for future applications. (C) 2009 Elsevier B.V. All rights reserved

Behaviour of CPW and TFMS lines versus high temperature for RF applications in sub-45 nm nodes

Coplanar waveguide (CPW) and thin film microstrip (TFMS) lines integrating porous ultra low-k as inter-metal dielectric layers (k = 2.5) and copper as metal, are for the first time experimentally measured up to 110 GHz and under different temperature conditions, up to 200 °C. The extracted attenuation and propagation coefficients of those transmission lines are compared to simulations performed with MAGWEL software, a frequency domain 3-D Maxwell solver. Based on the characterization results some guidelines related to interconnect design are presented for future applications

1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy

International audienceCopper/oxide hybrid bonding process has been extensively studied these past years as a key enabler for 3D high density application with top and bottom tier interconnection pitch below 10μm. Since 2015 hybrid bonding process robustness has been confirmed on complete electrical test vehicles [1,2] as well as commercial products [3] integrating copper to copper interconnection pitchs close to 6μm. To our knowledge, no results have been shown today demonstrating sub-1.5μm pitch copper hybrid bonding feasibility

ITAC: A complete 3D integration test platform

International audienceSystem integration takes benefit from 3D stacking technology in a wide range of applications such as smart imagers, photonic, wide I/O memories and high-performance computing. The 700 mm 2 ITAC 3D integration test platform contains a set of “Integrated Technological and Application Circuits” for process development, electrical and RF characterization, reliability, die stacking, warpage and underfilling studies, DC-DC converter and IntAct chip which is the full application chip. After a brief presentation of the targeted high performance computing application. The contributions integrated in the test platform are described with a particular focus on the 10 μm diameter 20 μm pitch die-to-die interconnects which is the key technology of the 3D stack. These test vehicles have been embedded on the same silicon to secure the application chip at all the steps from technology development to assembly and test

A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm 2 Inter-Chiplet Interconnects and 156mW/mm 2 @ 82%-Peak-Efficiency DC-DC Converters

International audienceIn the context of high performance computing, the integration of more computing capabilities with generic cores or dedicated accelerators for AI application is raising more and more challenges. Due to the increasing costs of advanced nodes and the difficulties of shrinking analog and circuit IOs, alternative architecture solutions to single die are becoming mainstream. Chiplet-based systems using 3D technologies enable modular and scalable architecture and technology partitioning. Nevertheless, there are still limitations due to chiplet integration on passive interposers – silicon or organic. In this paper we present the first CMOS active interposer, integrating i) power management without any external components, ii) distributed interconnects enabling any chiplet-to-chiplet communication, iii) system infrastructure, Design-for-Test, and circuit IOs. The INTACT circuit prototype integrates 6 chiplets in FDSOI 28nm technology, which are 3D-stacked onto this active interposer in 65nm process, offering a total of 96 computing cores. Full scalability of the computing system is achieved using an innovative scalable cache coherent memory hierarchy, enabled by distributed Network-on-Chips, with 3Tbit/s/mm2 high bandwidth 3D-plug interfaces using 20μm pitch micro-bumps, 0.6ns/mm low latency asynchronous interconnects, while the 6 chiplets are locally power-supplied with 156mW/mm2@ 82%-peak-efficiency DC-DC converters through the active interposer. Thermal dissipation is studied showing the feasibility of such approach

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management

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