Stress-Corrosion Cracking of Spin-on Glass Thin Films

ABSTRACTThe crack-velocity behavior of silsesqioxane spin-on glass thin films exposed to moist environments is examined. An absolute reaction-rate model is used to predict crack velocity using a deleted-bond model and fused silica as a basis, and compared with observed steady-state crack velocities as a function of film thickness and variations in the curing process. An implication is that, on curing, the driving force for film fracture, determined by thermal expansion mismatch, increases less rapidly than the fracture resistance, determined by polymerization.</jats:p

Effects of Environment on Modlus of Low-k Porous Films Used in Back End of Line

ABSTRACTReliability is an important requirement for the newly developed porous low-k ILD materials that are being introduced into (BEOL). Dependence of Young's moduli, as measured by nanoindentation technique, on the environment [such as high relative humidity, water immersion and recovery] is presented along with FT-IR spectra for a number of films with different k values. Effect of the moduli changes on cracking behavior is also discussed.</jats:p

Characterization of Spin -on Glasses by Microindentation.

ABSTRACTSpin-on glasses are candidates in the microelectronics industry as low dielectric constant insulating layers. Spin-on glasses are very brittle materials. This paper discusses measurement problems as relevant to the characterization of a brittle material by the indentation technique. As for all polymeric materials curing temperature is the most important preparation parameter. There is a correlation between hardness, Young's modulus, the onset of cracking with curing temperature. This dependence on curing temperature is also expressed by the change in Si-H bond density as shown by FTIR data. Life expectancy or aging characteristics were also investigated for these features. As an example results on silsesquioxane spin -on glasses are presented.</jats:p

Comparison of Electromigration in Cu Interconnects with ALD or PVD TaN Liners

Abstract not Available.</jats:p

Properties Development During Curing of Low Dielectric-Constant Spin-On Glasses

ABSTRACTVariations in the electrical and mechanical properties of silsesquioxane spin-on glass thin films are examined as a function of curing time and temperature. Particular attention is paid to the trade-off between producing low dielectric constant films, suitable for advanced microelectronic interconnection structures, and mechanically stable films, able to withstand semiconductor wafer fabrication processes. Two critical aspects of the mechanical stability of spin-on glasses are shown to be: the positive thermal expansion mismatch with silicon–leading to tensile film stresses; and reactivity with water–leading to susceptibility to stress-corrosion cracking.</jats:p