Intraoperative sentinel lymph node mapping in laparoscopic operations for colorectal cancer

INTRODUCTION: Laparoscopic resections in colorectal cancer gain an increasing popularity. Sentinel lymph node mapping in colorectal cancer and its advantages in daily practice are still subject of discussion. In laparoscopic operations, the procedure has same technical difficulties, although provides definite advan­tages in staging and estimating the extent of lymph dissection.MATERIALS AND METHODS: We present techniques for intraoperative sentinel lymph nodes mapping in colorectal cancer and their detection with surgical gamma probe in laparoscopic resection, which are used in our clinic, and the initial results from them.RESULTS: The initial results show that sentinel lymph nodes mapping with radionuclides and their detec­tion with surgical gamma probe are technically feasible in laparoscopic resections for colorectal cancer. The method has additional possibilities for the surgeon for estimating of the lymph drainage and precise stag­ing in laparoscopic operation.CONCLUSION: Nevertheless the contradictory opinions for application of sentinel lymph nodes mapping in colorectal cancer, the method provides certain advantages in improving staging. In laparoscopic opera­tions, although having some difficulties, it could be used, as it offers additional facilitation for the surgeon in estimating the lymph drainage in condition of decreased tactile sensation. Scr Sci Med 2017; 49(3):19-2

Transparent Electrostatic Clamp For Visual Assembly and Packaging

This paper describes the development of a miniature assembly cell for micro-electromechanical systems (MEMS). Potential applications of the developed assembly cell are assembly of miniature optical systems, integration of optoelectronics, such as laser diodes with CMOS, and epitaxial lift-off (ELO) of thin films used in optoelectronic devices. The cell utilizes a transparent electrostatic gripper and uses several disparate sensing modalities for position control: computer vision for part alignment with respect to the gripper, a fiber-coupled laser, and a position sensitive detector (PSD) for part to assembly alignment. Assembly experiments indicate that the gripping force and stage positioning accuracy are sufficient for insertion of 500µm wide parts in 550 µm wide slots etched in silicon wafers. Details on the cell operation, the control algorithm used and their limitations are also provided