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52 research outputs found

Physical Electronics and Surface Physics

Author: Engelmaier W.
Fehrs D. L.
Gadzuk J. W.
Lou Y. S.
Stickney Robert E.
Yamamoto S.
Publication venue: Research Laboratory of Electronics (RLE) at the Massachusetts Institute of Technology (MIT)
Publication date: 15/07/1966
Field of study

Contains reports on three research projects.Joint Services Electronics Programs (U. S. Army, U. S. Navy, and U. S. Air Force) under Contract DA 36-039-AMC-03200(E)National Aeronautics and Space Administration (Grant NGR-22-009-09-091)National Aeronautics and Space Administration (Grant NsG-496

Plasma Magnetohydrodynamics and Energy Conversion

Author: Brown G. A.
Engelmaier W.
Hoffman M. A.
Jackson W. D.
Kerrebrock J. L.
Lubin B. T.
McNary C. A.
Sachs S.
Solbes A.
Stickney Robert E.
Publication venue: Research Laboratory of Electronics (RLE) at the Massachusetts Institute of Technology (MIT)
Publication date: 15/10/1965
Field of study

Contains reports on five research projects.U. S. Air Force (Research and Technology Division) under Contract AF33(615)-1083 with the Air Force Aero Propulsion Laboratory, Wright-Patterson Air Force Base, Ohi

Temperature Cycling of Surface Mounted Thick Film ‘Zero‐ohm’ Jumpers

Author: Ainsworth P. A.
D.C. Whalley
D.S. Campbell
Engelmaier W.
Manson S. S.
Publication venue: 'Emerald'
Publication date
Field of study

Alloy 42 — A Material to be Avoided for Surface Mount Component Leads and Lead Frames

Author: B. Fuentes
Engelmaier W.
Engelmaier W.
Engelmaier W.
Engelmaier W.
Engelmaier W.
Manson S. S.
Morrow J. D.
Noctor D. M.
W. Engelmaier
Wild R. N.
Publication venue: 'Emerald'
Publication date
Field of study

BGA and CGA Solder Attachments: Results of Low‐acceleration Reliability Test and Analysis *

Author: W. Engelmaier
Publication venue: 'Emerald'
Publication date
Field of study

A Study of the Failure of Soldered SMT Joints during Thermal Cycling

Author: Engelmaier W
Engelmaier W.
J.H. Huang
Lau J. H.
W. Gao
Y.H. Jiang
Y.Y. Jian
Publication venue: 'Emerald'
Publication date
Field of study

The Influence of Metal Plating of Chip Carriers on Reliability of SMT Solder Joints under Thermal Cycling

Author: Engelmaier W.
Engelmaier W.
H.Z. Li
J.H. Huang
Lau J. H.
Smeby J. M.
Wolverton W. M.
Publication venue: 'Emerald'
Publication date
Field of study

Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction

Author: Balde J. W.
Clech J-P.
Clech J. -P.
Clip-Lead Solder
Engelmaier W.
Engelmaier W.
Engelmaier W.
Engelmaier W.
Fisher J. R.
Frear D.
Hall P. M.
Hines L. L. AT
Interconnecting Chip Carriers'
Karjalainen L. P.
Kotlowitz R. W.
Lampe B. T.
Liljestrand L. -G.
Manson S. S.
Morrow J. D.
W. Engelmaier
Wolverton W. M.
Publication venue: 'Emerald'
Publication date
Field of study

Figures of Merit Design Tools for Surface Mount Solder Joint Reliability

Author: Clech J-P.
Engelmaier W.
Engelmaier W.
Hall P. M.
Manson S. S.
Miner M. A.
Morrow J. D.
Shine M. C.
Solomon H. D.
W. Engelmaier
Wilcox J. R.
Wild R. N .
Publication venue: 'Emerald'
Publication date
Field of study

Reliability, Thermal and Thermomechanical Characteristics of Polymer‐on‐metal Multilayer Boards

Author: Engelmaier W.
Engelmaier W.
F. Gray
Finke T. E.
Jonas C.
M. Elkins
Measurement
Poradish F.
Prokop J.
Smith G.
Wild R. N.
Publication venue: 'Emerald'
Publication date
Field of study

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