9 research outputs found
A reconfigurable platform for real-time embedded video image processing
Abstract. The increasing ubiquity of embedded digital video capture creates demand for high-throughput, low-power, flexible and adaptable integrated image processing systems. An architecture for a system-ona-chip solution is proposed, based on reconfigurable computing. The inherent system modularity and the communication infrastructure are targeted at enhancing design productivity and reuse. Power consumption is addressed by a combination of efficient streaming data transfer and reuse mechanisms. It is estimated that the proposed system would be capable of performing up to ten complex image manipulations simultaneously and in real-time on video resolutions up to XVGA.
A Technology-Scalable Architecture for Fast Clocks and High ILP
CMOS technology scaling poses challenges in designing dynamically scheduled cores that can sustain both high instruction-level parallelism and aggressive clock frequencies. In this paper, we present a new architecture that maps compiler-scheduled blocks onto a two-dimensional gri
3D-SoftChip: A Novel Architecture for Next-Generation Adaptive Computing Systems
<p/> <p>This paper introduces a novel architecture for next-generation adaptive computing systems, which we term 3D-SoftChip. The 3D-SoftChip is a 3-dimensional (3D) vertically integrated adaptive computing system combining state-of-the-art processing and 3D interconnection technology. It comprises the vertical integration of two chips (a configurable array processor and an intelligent configurable switch) through an indium bump interconnection array (IBIA). The configurable array processor (CAP) is an array of heterogeneous processing elements (PEs), while the intelligent configurable switch (ICS) comprises a switch block, 32-bit dedicated RISC processor for control, on-chip program/data memory, data frame buffer, along with a direct memory access (DMA) controller. This paper introduces the novel 3D-SoftChip architecture for real-time communication and multimedia signal processing as a next-generation computing system. The paper further describes the advanced HW/SW codesign and verification methodology, including high-level system modeling of the 3D-SoftChip using SystemC, being used to determine the optimum hardware specification in the early design stage.</p