29 research outputs found

    Proceedings of IPACK'03 The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition

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    ABSTRACT Today's data centers are designed for handling heat densities of 1000W/m 2 at the room level. Trends indicate that these heat densities will exceed 3000W/m 2 in the near future. As a result, cooling of data centers has emerged as an area of increasing importance in electronics thermal management. With these high heat loads, data center layout and design cannot rely on intuitive design of air distribution and requires analytical tools to provide the necessary insight to the problem. These tools can also be used to optimize the layout of the room to improve energy efficiency in the data center. In this paper, first an under floor analysis is done to find an optimized layout based on flow distribution through perforated tiles, then a complete Computational Fluid Dynamics (CFD) model of the data center facility is done to check for desired cooling and air flow distribution throughout the room. A robust methodology is proposed which helps for fast, easy, efficient modeling and analysis of data center design. Results are displayed to provide some guidance on the layout and design of data center. The resulting design approach is very simple and well suited for the energy efficient design of complex data centers and server farms

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