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2 research outputs found
Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints
Author
CM Chen
DAA Shnawah
+16Â more
DL Li
DQ Yu
FL Sun
H Xiao
J Xia
K Uenishi
L Sun
LM Yin
LM Yin
LM Yin
S Sakatani
SJ Shang
WK Mu
XZ Sa
Y Kim
Y Zhu
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref
Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
Author
AA El-Daly
AE Hammad
+34Â more
Cadmus A. Yuan
CY Liu
DAA Shnawah
DW Henderson
F Sun
Fenglian Sun
Guoqi Zhang
GY Jang
H Wang
Honglin Zhang
HR Kotadia
Joost Meerwijk
JW Yoon
JY Kim
K Zeng
KJ Chen
L Xu
LC Tsao
Liangliang Luo
M Berthou
M Huang
M Sona
PJ Shang
PT Vianco
SH Kim
SK Kang
T Laurila
U Kattner
VI Dybkov
Y Liu
Y Liu
Yang Liu
YQ Wu
YW Yen
Publication venue
'Springer Science and Business Media LLC'
Publication date
Field of study
No full text
Crossref